journal article·2020-04-28

Cumulative Impacts of Proton Irradiation on the Self-heating of AlGaN/GaN HEMTs

Bikramjit Chatterjee, Daniel Shoemaker, Yiwen Song, Tan Shi, Hsien-Lien Huang, Dongmin Keum, Anusha Krishnan, Brian M. Foley, Igor Jovanovic, Jinwoo Hwang, Hyungtak Kim, Sukwon Choi

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Abstract

The impact of proton irradiation on the self-heating of AlGaN/GaN high-electron-mobility transistors (HEMTs) was studied at an energy of 1 MeV and under a fluence level of 2 × 1015 cm–2. Severe degradation in electrical characteristics was observed under these conditions (5× reduction in drain saturation current at VGS = 0 V, positive shift in threshold voltage by 3.1 V). Concomitantly, an 80% increase in the device gate temperature was observed using a thermoreflectance thermal imaging technique, at a power dissipation level of 5 W/mm. One of the key contributing factors behind this exacerbated self-heating for the irradiated devices was found to be the increased electric field concentration at the drain side of the gate edge because of a higher drain–source voltage level required to operate the device at the same power density condition before irradiation. Additionally, reduction in thermal conductivity of the gallium nitride (GaN) layer and the silicon (Si) substrate led to increased thermal resistance and, hence, an increased device operating temperature. According to the stopping and range of ions in matter (SRIM) simulation, the penetration depth for the protons was ∼8.8 μm under the tested conditions. As the GaN/Si interface structure (including the AlGaN strain-relief layer) for the tested HEMTs was about 5 μm away from the surface, significant damage occurred near this heterointerface. This damage resulted in an ∼3× increase in the effective interfacial thermal boundary resistance that contributed to an additional 16% increase in device self-heating. Overall, the degradation of electrical parameters (24%), the GaN thermal conductivity (33%), the GaN/Si effective thermal boundary conductance (16%), and the Si substrate thermal conductivity (20%) contributed to the exacerbated self-heating in the irradiated AlGaN/GaN HEMT (∼90 °C) as compared to that of the reference (i.e., nonradiated) HEMT (∼50 °C), under a power density condition of 5 W/mm.
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Research context

OpenAlex topics: GaN-based semiconductor devices and materials · Semiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States

Department of Nuclear Engineering and Radiological Sciences, University of Michigan, Ann Arbor, Michigan 48109, United States

Department of Materials Science and Engineering, The Ohio State University, Columbus, Ohio 43210, United States

School of Electronic and Electrical Engineering, Hongik University, Seoul 04066, Korea

Funding

National Research Foundation of Korea · Air Force Office of Scientific Research

References (60)

Show source-provided references
1. 10.1109/JPROC.2002.102156710.1109/JPROC.2002.1021567 ↗
2. 10.1109/MMW.2005.141799810.1109/MMW.2005.1417998 ↗
3. 10.1109/TNS.2002.80536310.1109/TNS.2002.805363 ↗
4. Patterson, R. L.; Hammoud, A.; Elbuluk, M. In Electronic Components for Use in Extreme Temperature Aerospace Applications, 12th International Components for Military and Space Electronics Conference; 2008.
5. 10.1109/TNS.2003.82182710.1109/TNS.2003.821827 ↗
6. 10.1109/TNS.2004.83919910.1109/TNS.2004.839199 ↗
7. 10.1016/j.sse.2008.02.00510.1016/j.sse.2008.02.005 ↗
8. 10.1109/LED.2014.233100110.1109/LED.2014.2331001 ↗
9. 10.1149/2.0021809jss10.1149/2.0021809jss ↗
10. 10.1109/TNS.2016.261222710.1109/TNS.2016.2612227 ↗
11. 10.1109/TNS.2015.249520910.1109/TNS.2015.2495209 ↗
12. 10.1149/2.0071711jss10.1149/2.0071711jss ↗
13. 10.1016/j.microrel.2006.02.00910.1016/j.microrel.2006.02.009 ↗
14. Lee, S.; Vetury, R.; Brown, J. D.; Gibb, S. R.; Cai, W. Z.; Sun, J.; Green, D. S.; Shealy, J. In Reliability Assessment of AlGaN/GaN HEMT Technology on SIC for 48V Applications, IEEE International Reliability Physics Symposium Proceedings; IEEE, 2008; pp 446–449.
15. 10.1116/1.489162910.1116/1.4891629 ↗
16. 10.1109/TED.2012.222411510.1109/TED.2012.2224115 ↗
17. Chatterjee, B.; Lundh, J. S.; Dallas, J.; Kim, H.; Choi, S. In Electro-Thermal Reliability Study of GaN High Electron Mobility Transistors, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm); 2017; pp 1247–1252.10.1109/ITHERM.2017.7992627 ↗
18. 10.1021/acsami.8b1752510.1021/acsami.8b17525 ↗
19. 10.1016/j.microrel.2019.11349310.1016/j.microrel.2019.113493 ↗
20. 10.1016/j.spmi.2006.07.01710.1016/j.spmi.2006.07.017 ↗
21. 10.1063/1.505618210.1063/1.5056182 ↗
22. Martines, L. M. S. Analysis of LEO Radiation Environment and Its Effects on Spacecraft’ s Critical Electronic Devices. Dissertations and Theses, Embry-Riddle Aeronautical University, 2011.
23. 10.1088/1748-0221/14/10/T1000210.1088/1748-0221/14/10/T10002 ↗
24. Koehler, A. D.; Anderson, T. J.; Hite, J. K.; Weaver, B. D.; Tadjer, M. J.; Mastro, M. A.; Greenlee, J. D.; Specht, P.; Porter, M.; Weatherford, T. R.; Hobart, K. D.; Kub, F. J. In Degradation Mechanisms of AlGaN/GaN HEMTs on Sapphire, Si, and SiC Substrates under Proton Irradiation, 2nd IEEE Work. Wide Bandgap Power Devices Applications (WiPDA 2014); 2014; pp 33–35.10.1109/WiPDA.2014.6964619 ↗
25. 10.1109/TNS.2004.82507710.1109/TNS.2004.825077 ↗
26. 10.1109/TNS.2003.82079210.1109/TNS.2003.820792 ↗
27. 10.1016/j.ijheatmasstransfer.2017.09.04810.1016/j.ijheatmasstransfer.2017.09.048 ↗
28. 10.1063/1.498376110.1063/1.4983761 ↗
29. 10.1109/TED.2015.244385910.1109/TED.2015.2443859 ↗
30. 10.1109/TED.2014.231867210.1109/TED.2014.2318672 ↗
31. 10.1016/j.microrel.2007.01.09010.1016/j.microrel.2007.01.090 ↗
32. 10.1063/1.511501310.1063/1.5115013 ↗
33. 10.1063/1.500679610.1063/1.5006796 ↗
34. 10.1109/TNS.2015.249916010.1109/TNS.2015.2499160 ↗
35. 10.1088/0034-4885/18/1/30110.1088/0034-4885/18/1/301 ↗
36. 10.1016/j.nimb.2010.02.09110.1016/j.nimb.2010.02.091 ↗
37. 10.1103/PhysRevB.78.04520210.1103/PhysRevB.78.045202 ↗
38. 10.1063/1.315327710.1063/1.3153277 ↗
39. 10.1063/1.500975010.1063/1.5009750 ↗
40. 10.1016/0029-5493(75)90035-710.1016/0029-5493(75)90035-7 ↗
41. 10.1149/2.0281607jss10.1149/2.0281607jss ↗
42. 10.1063/1.497432110.1063/1.4974321 ↗
43. 10.1063/1.173528510.1063/1.1735285 ↗
44. 10.1016/j.microrel.2013.03.00410.1016/j.microrel.2013.03.004 ↗
45. 10.1002/pip.467003030310.1002/pip.4670030303 ↗
46. 10.1557/jmr.2015.1110.1557/jmr.2015.11 ↗
47. 10.1063/1.273894610.1063/1.2738946 ↗
48. 10.1109/TED.2006.88394410.1109/TED.2006.883944 ↗
49. Baczkowski, L.; Carisetti, D.; Jacquet, J.; Kendig, D. In Thermal Characterization of High Power AlGaN/GaN HEMTs Using Infra Red Microscopy and Thermoreflectance, 20th International Workshop on Thermal Investigations of ICs and Systems; 2014; pp 1–6.10.1109/THERMINIC.2014.6972538 ↗
50. 10.1109/TED.2006.88227410.1109/TED.2006.882274 ↗
51. 10.1109/TED.2008.91670910.1109/TED.2008.916709 ↗
52. 10.1049/iet-smt.2018.542710.1049/iet-smt.2018.5427 ↗
53. 10.1049/ip-g-2.1991.006510.1049/ip-g-2.1991.0065 ↗
54. Maize, K.; Christofferson, J.; Shakouri, A. In Transient Thermal Imaging Using Thermoreflectance, 2008 Twenty-Fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium; IEEE, 2008; pp 55–58.10.1109/STHERM.2008.4509366 ↗
55. Chatterjee, B.; Kim, T. K.; Song, Y.; Lundh, J. S.; Han, S.; Shoemaker, D.; Min, J. In Enhancement of the Electrical and Thermal Performance of AlGaN/GaN HEMTs Using a Novel Resistive Field Plate Structure, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm); IEEE, 2019; pp 362–369.10.1109/ITHERM.2019.8757330 ↗
56. Maize, K. High Resolution Thermoreflectance Imaging of Power Transistors and Nanoscale Percolation Networks. Theses and Dissertations, UC Santa Cruz, 2014.
57. Maize K. · IEEE Int. Reliab. Phys. Symp. Proc. · 2013 · CD.2.1
58. 10.1063/1.490735410.1063/1.4907354 ↗
59. Shakouri, A.; Ziabari, A.; Kendig, D.; Bahk, J.H.; Xuan, Y.; Peide, D. Y.; Yazawa, K.; Shakouri, A. In Stable Thermoreflectance Thermal Imaging Microscopy with Piezoelectric Position Control, 2016 32nd Thermal Measurement, Modeling & Management Symposium; 2016; pp 128–132.10.1109/SEMI-THERM.2016.7458456 ↗
60. 10.1115/1.403871310.1115/1.4038713 ↗