Lattice-matched InAlN/GaN high-electron-mobility transistors (HEMTs)
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: GaN-based semiconductor devices and materials · Radio Frequency Integrated Circuit Design · Semiconductor Quantum Structures and Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (100+)
Show source-provided references
1. Jones EA, Wang F, Ozpineci B (2014) Application-based review of GaN HFETs. In: 2014 IEEE workshop on wide bandgap power devices and applications. IEEE, 24–29 Oct 201410.1109/WiPDA.2014.6964617 ↗
2. Mishra UK, Parikh P, Wu YF (2002) AlGaN/GaN HEMTs-an overview of device operation and applications. Proc IEEE 90(6):1022–103110.1109/JPROC.2002.1021567 ↗
3. Micovic M, Brown DF, Regan D, Wong J, Tang Y, Herrault F, Santos D, Burnham SD, Tai J, Prophet E, Khalaf I (2016) High frequency GaN HEMTs for RF MMIC applications. In: 2016 IEEE International Electron Devices Meeting (IEDM), IEEE, 3–3 Dec 201610.1109/IEDM.2016.7838337 ↗
4. Ma CT, Gu ZH (2019) Review of GaN HEMT applications in power converters over 500 W. Electronics 8(12):140110.3390/electronics8121401 ↗
5. Kuzmik J (2002) InAlN/(In) GaN high electron mobility transistors: some aspects of the quantum well heterostructure proposal. Semicond Sci Technol 17(6):54010.1088/0268-1242/17/6/307 ↗
6. Neuburger M, Zimmermann T, Kohn E, Dadgar A, Schulze F, Krtschil A, Gunther M, Witte H, Blasing J, Krost A, Daumiller I (2004) Unstrained InAlN/GaN HEMT structure. InProceedings. IEEE Lester Eastman Conference on High Performance Devices. IEEE, 161–166, 2004 Aug 410.1109/LECHPD.2004.1549688 ↗
7. Katzer DS, Storm DF, Binari SC, Shanabrook BV, Torabi A, Zhou L, Smith DJ (2005) Molecular beam epitaxy of InAlN∕ GaN heterostructures for high electron mobility transistors. J Vac Sci Technol B: Microelectron Nanometer Struct Process, Meas Phenomena 23(3):1204–120810.1116/1.1927103 ↗
8. Kuzmik J, Kostopoulos A, Konstantinidis G, Carlin JF, Georgakilas A, Pogany D (2006) InAlN/GaN HEMTs: a first insight into technological optimization. IEEE Trans Electron Devices 53(3):422–42610.1109/TED.2005.864379 ↗
9. Medjdoub F, Carlin JF, Gonschorek M, Feltin E, Py MA, Ducatteau D, Gaquiere C, Grandjean N, Kohn E (2006) Can InAlN/GaN be an alternative to high power/high temperature AlGaN/GaN devices?. In: 2006 International Electron Devices Meeting, IEEE, 1–410.1109/IEDM.2006.346935 ↗
10. Kohn E, Medjdoub F (2007) InAlN-A new barrier material for GaN-based HEMTs. In: 2007 International Workshop on Physics of Semiconductor Devices, IEEE, 311–31610.1109/IWPSD.2007.4472506 ↗
11. Maier D, Alomari M, Grandjean N, Carlin JF, Diforte-Poisson MA, Dua C, Chuvilin A, Troadec D, Gaquière C, Kaiser U, Delage S (2009) Above 500 C Operation of InAlN/GaN HEMTs. In2009 Device Research Conference, IEEE, 285–28610.1109/DRC.2009.5354902 ↗
12. Alomari M, Maier D, Carlin JF, Grandjean N, Poisson MA, Delage S, Kohn E (2009) Au free ohmic contacts for high temperature InAlN/GaN HEMT’s. ECS Trans 25(12):3310.1149/1.3238203 ↗
13. Lee DS, Lu B, Azize M, Gao X, Guo S, Kopp D, Fay P, Palacios T (2011) Impact of GaN channel scaling in InAlN/GaN HEMTs. In: 2011 International Electron Devices Meeting, IEEE, 19–210.1109/IEDM.2011.6131583 ↗
14. Wang R, Saunier P, Tang Y, Fang T, Gao X, Guo S, Snider G, Fay P, Jena D, Xing H (2011) Enhancement-mode InAlN/AlN/GaN HEMTs 10–12 A/mm leakage current and 1012 on/off current ratio. IEEE Electron Device Lett 32(3):309–31110.1109/LED.2010.2095494 ↗
15. Xue J, Hao Y, Zhang J, Zhou X, Liu Z, Ma J, Lin Z (2011) Nearly lattice-matched InAlN/GaN high electron mobility transistors grown on SiC substrate by pulsed metal organic chemical vapor deposition. Appl Phys Lett 98(11):11350410.1063/1.3567529 ↗
16. Maier D, Alomari M, Grandjean N, Carlin JF, Diforte-Poisson MA, Dua C, Delage S, Kohn E (2012) InAlN/GaN HEMTs for operation in the 1000 °C regime: a first experiment. IEEE Electron Device Lett 33(7):985–98710.1109/LED.2012.2196972 ↗
17. Kuzmík J (2012) N-polarity InN/GaN/InAlN high-electron-mobility transistors. Appl Phys Express 5(4):04410110.1143/APEX.5.044101 ↗
18. Hiroki M, Watanabe N, Maeda N, Yokoyama H, Kumakura K, Yamamoto H (2013) Influence of metalorganic vapor phase epitaxy regrowth on characteristics of InAlN/AlGaN/GaN high electron mobility transistors. Jpn J Appl Phys 52(4S):04CF0210.7567/JJAP.52.04CF02 ↗
19. Kyaw LM, Liu Y, Bera MK, Ngoo YJ, Tripathy S, Chor EF (2013) Gold-free InAlN/GaN schottky gate HEMT On Si (111) substrate with ZrO2 passivation. ECS Trans 53(2):7510.1149/05302.0075ecst ↗
20. Malmros A, Gamarra P, Thorsell M, Forte-Poisson MA, Lacam C, Tordjman M, Aubry R, Zirath H, Rorsman N (2014) Evaluation of an InAlN/AlN/GaN HEMT with Ta-based ohmic contacts and PECVD SiN passivation. Phys Status Solidi (c) 11:924–92710.1002/pssc.201300320 ↗
21. Ichikawa H, Mizue C, Makabe I, Tateno Y, Nakata K, Inoue K (2014) AlGaN/GaN HEMTs versus InAlN/GaN HEMTs fabricated by150-nm Y-gate process. In: 2014 Asia-Pacific Microwave Conference, IEEE, 780–782
22. Malmros A, Chen JT, Hjelmgren H, Lu J, Hultman L, Kordina O, Sveinbjörnsson EÖ, Zirath H, Rorsman N (2019) Enhanced mobility in InAlN/AlN/GaN HEMTs using a GaN interlayer. IEEE Trans Electron Devices 66(7):2910–291510.1109/TED.2019.2914674 ↗
23. Ambacher O, Christian B, Yassine M, Baeumler M, Leone S, Quay R (2021) Polarization induced interface and electron sheet charges of pseudomorphic ScAlN/GaN, GaAlN/GaN, InAlN/GaN, and InAlN/InN heterostructures. J Appl Phys 129(20):20450110.1063/5.0049185 ↗
24. Charan VS, Vura S, Muralidharan R, Raghavan S, Nath DN (2021) Scandium-based ohmic contacts to InAlN/GaN heterostructures on silicon. IEEE Electron Device Lett 42(4):497–50010.1109/LED.2021.3056757 ↗
25. Du F, Jiang Y, Qiao Z, Wu Z, Tang C, He J, Zhou G, Cheng WC, Tang X, Wang Q, Yu H (2022) Atomic layer etching technique for InAlN/GaN heterostructure with AlN etch-stop layer. Mater Sci Semicond Process 1(143):10654410.1016/j.mssp.2022.106544 ↗
26. Narang K, Bag RK, Pandey A, Goyal A, Singh VK, Lohani J, Yadav BS, Saini S, Bharti P, Dalal S, Padmavati MV (2023) Structural, electrical, morphological, and interfacial characteristics of lattice-matched InAlN/GaN HEMT structure on SiC substrate. J Appl Phys 134(14):14530210.1063/5.0141724 ↗
27. Douara A, Rabehi A, Guermoui M, Daha R, Tibermacine IE (2024) Simulation-based optimization of barrier and spacer layers in InAlN/GaN HEMTs for improved 2DEG density. Micro Nanostructures 1(195):20795010.1016/j.micrna.2024.207950 ↗
28. Wu X, He J, Cheng Z, Xie S, Mi C, Zhang L, Sun H, Zhang Y (2024) Ultra-Thin Barrier Enhancement-Mode InAlN/GaN HEMTs on Sapphire Substrate with a DIBL of 5.2 mV/V. In: 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), IEEE, 318–32010.1109/SSLCHINAIFWS64644.2024.10835391 ↗
29. Yu Q, Yang L, Zhang M, Shi C, Zou X, Gao W, Hou B (2024) Simulation of high-frequency noise performance of GaN HEMT devices with different barrier layers/dielectric layers. In: 2024 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) IEEE, 1–310.1109/IMWS-AMP62793.2024.10966578 ↗
30. Douara A, Rabehi A, Guermoui M, Daha R, Tibermacine IE (2024) Impact of AlN buffer layer thickness on electronic and electrical characteristics of In0. 17Al0. 83N/GaN high-electron-mobility transistor. Phys Solid State 66(6):157–16410.1134/S1063783424600766 ↗
31. Patel Y, Valizadeh P (2024) A comparative study on the effects of planarity of access region on the low-frequency noise performance of InAlN/GaN HFETs. IEEE J Electron Devices Soc 12:338–34410.1109/JEDS.2024.3392174 ↗
32. Gao G, Liu Z, Hao L, Du H, Xing W, Zhou H, Zhang W, Li X, Zhang J, Hao Y (2024) InAlN/GaN MISHEMTs with 120 nm T-shape recessed gates on silicon with excellent mm-wave noise performance. IEEE Microwave Wireless Technol Lett 34(4):399–40210.1109/LMWT.2024.3353773 ↗
33. Patel Y, Valizadeh P (2024) Investigation of the DC Performance and Linearity of InAlN/GaN HFETs via Studying the Impact of the Scaling of LGS and LG on the Source Access Resistance. IEEE J Electron Devices Soc 12:525–53310.1109/JEDS.2024.3428969 ↗
34. Luo X, Cui P, Linewih H, Cheong KY, Xu M, Chen S, Wang L, Sun J, Dai J, Xu X, Han J (2024) Influence of post fabrication annealing on device performance of InAlN/GaN high electron mobility transistors. J Phys Chem Solids 1(187):11187010.1016/j.jpcs.2024.111870 ↗
35. Shi D, Yang J, Zhao J, Hao M, Li L (2025) Theoretical investigations on the confinement properties of InAlN/GaN/AlGaN heterostructures employing AlxGa1-xN as back-barrier. Eur Phy J Appl Phy 100:710.1051/epjap/2025006 ↗
36. Jessen GH, Gillespie JK, Via GD, Crespo A, Langley D, Aumer ME, Ward CS, Henry HG, Thomson DB, Partlow DP (2007) RF Power measurements of InAlN/GaN unstrained HEMTs on SiC substrates at 10 GHz. IEEE Electron Device Lett 28(5):354–35610.1109/LED.2007.895417 ↗
37. Medjdoub F, Alomari M, Carlin JF, Gonschorek M, Feltin E, Py MA, Grandjean N, Kohn E (2008) Barrier-layer scaling of InAlN/GaN HEMTs. IEEE Electron Device Lett 29(5):422–42510.1109/LED.2008.919377 ↗
38. Crespo A, Bellot MM, Chabak KD, Gillespie JK, Jessen GH, Miller V, Trejo M, Via GD, Walker DE, Winningham BW, Smith HE (2009) High-power Ka-band performance of AlInN/GaN HEMT with 9.8-nm-thin barrier. IEEE Electron Device Lett 31(1):2–410.1109/LED.2009.2034875 ↗
39. Sarazin N, Morvan E, di Forte Poisson MA, Oualli M, Gaquiere C, Jardel O, Drisse O, Tordjman M, Magis M, Delage SL (2009) AlInN/AlN/GaN HEMT technology on SiC with 10-W/mm and 50% PAE at 10 GHz. IEEE Electron Device Lett 31(1):11–1310.1109/LED.2009.2035145 ↗
40. Sun H, Alt AR, Benedickter H, Bolognesi CR, Feltin E, Carlin JF, Gonschorek M, Grandjean N, Maier T, Quay R (2009) 102-GHz AlInN/GaN HEMTs on silicon with 25-W/mm output power at 10 GHz. IEEE Electron Device Lett 30(8):796–79810.1109/LED.2009.2023603 ↗
41. Wang H, Chung JW, Gao X, Guo S, Palacios T (2010) Al2O3 passivated InAlN/GaN HEMTs on SiC substrate with record current density and transconductance. Phys Status Solidi C 7(10):2440–244410.1002/pssc.200983899 ↗
42. Kuzmik J, Ostermaier C, Pozzovivo G, Basnar B, Schrenk W, Carlin JF, Gonschorek M, Feltin E, Grandjean N, Douvry Y, Gaquière C (2010) Proposal and performance analysis of normally Off n++ GaN/InAlN/AlN/GaN HEMTs With 1-nm-thick InAlN barrier. IEEE Trans Electron Devices 57(9):2144–215410.1109/TED.2010.2055292 ↗
43. Sun H, Alt AR, Benedickter H, Feltin E, Carlin JF, Gonschorek M, Grandjean NR, Bolognesi CR (2010) 205-GHz (Al, In) N/GaN HEMTs. IEEE Electron Device Lett 31(9):957–95910.1109/LED.2010.2055826 ↗
44. Lee DS, Gao X, Guo S, Palacios T (2011) Inaln/gan hemts with algan back barriers. IEEE Electron Device Lett 32(5):617–61910.1109/LED.2011.2111352 ↗
45. Lee DS, Chung JW, Wang H, Gao X, Guo S, Fay P, Palacios T (2011) 245-GHz InAlN/GaN HEMTs with oxygen plasma treatment. IEEE Electron Device Lett 32(6):755–75710.1109/LED.2011.2132751 ↗
46. Wang R, Li G, Laboutin O, Cao Y, Johnson W, Snider G, Fay P, Jena D, Xing H (2011) 210-GHz InAlN/GaN HEMTs with dielectric-free passivation. IEEE Electron Device Lett 32(7):892–89410.1109/LED.2011.2147753 ↗
47. Tirelli S, Marti D, Sun H, Alt AR, Carlin JF, Grandjean N, Bolognesi CR (2011) Fully Passivated AlInN/GaN HEMTs With fT/fmax of 205/220 GHz. IEEE Electron Device Lett 32(10):1364–136610.1109/LED.2011.2162087 ↗
48. Piotrowicz S, Chartier E, Jardel O, Dufraisse J, Callet G, Jacquet JC, Lancereau D, Morvan E, Aubry R, Sarazin N, Dua C (2011) Development of InAlN/GaN HEMTs power devices in S-band. In: 2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), IEEE, 1–410.1109/CSICS.2011.6062455 ↗
49. Lecourt F, Ketteniss N, Behmenburg H, Defrance N, Hoel V, Eickelkamp M, Vescan A, Giesen C, Heuken M, De Jaeger JC (2011) InAlN/GaN HEMTs on sapphire substrate with 2.9-W/mm output power density at 18 GHz. IEEE Electron Device Lett 32(11):1537–153910.1109/LED.2011.2166949 ↗
50. Jardel O, Callet G, Dufraisse J, Piazza M, Sarazin N, Chartier E, Oualli M, Aubry R, Reveyrand T, Jacquet JC, Poisson MA (2011) Electrical performances of AlInN/GaN HEMTs. A comparison with AlGaN/GaN HEMTs with similar technological process. Int J Microw Wirel Technol 3(3):301–30910.1017/S1759078711000419 ↗
51. Lee DS, Gao X, Guo S, Kopp D, Fay P, Palacios T (2011) 300-ghz inaln/gan Hemts with ingan back barrier. IEEE Electron Device Lett 32(11):1525–152710.1109/LED.2011.2164613 ↗
52. Liu B, Feng Z, Zhang S, Dun S, Yin J, Li J, Wang J, Zhang X, Fang Y, Cai S (2011) A 4.69-W/mm output power density InAlN/GaN HEMT grown on sapphire substrate. J Semicond 32(12):12400310.1088/1674-4926/32/12/124003 ↗
53. Yue Y, Hu Z, Guo J, Sensale-Rodriguez B, Li G, Wang R, Faria F, Fang T, Song B, Gao X, Guo S (2012) InAlN/AlN/GaN HEMTs with regrown ohmic contacts and fT of 370 GHz. IEEE Electron Device Lett 33(7):988–99010.1109/LED.2012.2196751 ↗
54. Dasgupta S, Lu J, Speck JS, Mishra UK (2012) Self-aligned N-polar GaN/InAlN MIS-HEMTs with record extrinsic transconductance of 1105 mS/mm. IEEE Electron Device Lett 33(6):794–79610.1109/LED.2012.2190965 ↗
55. Xue J, Zhang J, Zhang K, Zhao Y, Zhang L, Ma X, Li X, Meng F, Hao Y (2012) Fabrication and characterization of InAlN/GaN-based double-channel high electron mobility transistors for electronic applications. J Appl Phys 111(11):11451310.1063/1.4729030 ↗
56. Yue Y, Hu Z, Guo J, Sensale-Rodriguez B, Li G, Wang R, Faria F, Song B, Gao X, Guo S, Kosel T (2013) Ultrascaled InAlN/GaN high electron mobility transistors with cutoff frequency of 400 GHz. Jpn J Appl Phys 52(8S):08JN1410.7567/JJAP.52.08JN14 ↗
57. Schuette ML, Ketterson A, Song B, Beam E, Chou TM, Pilla M, Tserng HQ, Gao X, Guo S, Fay PJ, Xing HG (2013) Gate-recessed integrated E/D GaN HEMT technology with f T/f max> 300 GHz. IEEE Electron Device Lett 34(6):741–74310.1109/LED.2013.2257657 ↗
58. Saunier P, Schuette ML, Chou TM, Tserng HQ, Ketterson A, Beam E, Pilla M, Gao X (2013) InAlN barrier scaled devices for very high fT and for low-voltage RF applications. IEEE Trans Electron Devices 60(10):3099–310410.1109/TED.2013.2277772 ↗
59. Tirelli S, Lugani L, Marti D, Carlin JF, Grandjean N, Bolognesi CR (2013) AlInN-based HEMTs for large-signal operation at 40 GHz. IEEE Trans Electron Devices 60(10):3091–309810.1109/TED.2013.2262136 ↗
60. Watanabe A, Freedsman JJ, Oda R, Ito T, Egawa T (2014) Characterization of InAlN/GaN high-electron-mobility transistors grown on Si substrate using graded layer and strain-layer superlattice. Appl Phys Express 7(4):04100210.7567/APEX.7.041002 ↗
61. Song B, Sensale-Rodriguez B, Wang R, Guo J, Hu Z, Yue Y, Faria F, Schuette M, Ketterson A, Beam E, Saunier P (2014) Effect of fringing capacitances on the RF performance of GaN HEMTs with T-gates. IEEE Trans Electron Devices 61(3):747–75410.1109/TED.2014.2299810 ↗
62. Ganguly S, Verma J, Hu Z, Xing HG, Jena D (2014) Performance enhancement of InAlN/GaN HEMTs by KOH surface treatment. Appl Phys Express 7(3):03410210.7567/APEX.7.034102 ↗
63. Piotrowicz S, Jardel O, Chartier E, Aubry R, Baczkowski L, Casbon M, Dua C, Escotte L, Gamarra P, Jacquet JC, Michel N (2014) 12W/mm with 0.15 µm InAlN/GaN HEMTs on SiC technology for K and Ka-Bands applications. In: 2014 IEEE MTT-S International Microwave Symposium (IMS2014), IEEE, 1–310.1109/MWSYM.2014.6848347 ↗
64. Tsou CW, Lin CY, Lian YW, Hsu SS (2015) 101-GHz InAlN/GaN HEMTs on silicon with high Johnson’s figure-of-merit. IEEE Trans Electron Devices 62(8):2675–267810.1109/TED.2015.2439699 ↗
65. Ma C, Gu G, Lü Y (2016) A high performance InAlN/GaN HEMT with low Ron and gate leakage. J Semicond 37(2):02400910.1088/1674-4926/37/2/024009 ↗
66. Han T, Dun S, Lü Y, Gu G, Song X, Wang Y, Xu P, Feng Z (2016) 70-nm-gated InAlN/GaN HEMTs grown on SiC substrate with fT/fmax > 160 GHz. J Semicond 37(2):02400710.1088/1674-4926/37/2/024007 ↗
67. Xu D, Chu K, Diaz JA, Ashman MD, Komiak JJ, Pleasant LM, Vera A, Seekell P, Yang X, Creamer C, Nichols KB (2016) 0.1 μm InAlN/GaN High electron-mobility transistors for power amplifiers operating at 71–76 and 81–86 GHz: impact of passivation and gate recess. IEEE Trans Electron Devices 63(8):3076–308310.1109/TED.2016.2579160 ↗
68. Murugapandiyan P, Ravimaran S, William J, Sundaram KM (2017) Design and analysis of 30 nm T-gate InAlN/GaN HEMT with AlGaN back-barrier for high power microwave applications. Superlattices Microstruct 1(111):1050–105710.1016/j.spmi.2017.08.002 ↗
69. Murugapandiyan P, Ravimaran S, William J, Ajayan J, Nirmal D (2017) DC and microwave characteristics of 20 nm T-gate InAlN/GaN high electron mobility transistor for high power RF applications. Superlattices Microstruct 1(109):725–73410.1016/j.spmi.2017.05.060 ↗
70. Murugapandiyan P, Ravimaran S, William J (2017) Static and dynamic characteristics of Lg 50 nm InAlN/AlN/GaN HEMT with AlGaN back-barrier for high power millimeter wave applications. J Sci: Adv Mater Devices 2(4):515–522
71. Xing W, Liu Z, Qiu H, Ranjan K, Gao Y, Ng GI, Palacios T (2017) InAlN/GaN HEMTs on Si with high fT of 250 GHz. IEEE Electron Device Lett 39(1):75–7810.1109/LED.2017.2773054 ↗
72. Cui P, Mercante A, Lin G, Zhang J, Yao P, Prather DW, Zeng Y (2019) High-performance InAlN/GaN HEMTs on silicon substrate with high fT×Lg. Appl Phys Express 12(10):10400110.7567/1882-0786/ab3e29 ↗
73. Mi M, Wu S, Zhang M, Yang L, Hou B, Zhao Z, Guo L, Zheng X, Ma X, Hao Y (2019) Improving the transconductance flatness of InAlN/GaN HEMT by modulating VT along the gate width. Appl Phys Express 12(11):11400110.7567/1882-0786/ab48bf ↗
74. Cui P, Zhang J, Yang TY, Chen H, Zhao H, Lin G, Wei L, Xiao JQ, Chueh YL, Zeng Y (2019) Effects of N2O surface treatment on the electrical properties of the InAlN/GaN high electron mobility transistors. J Phys D Appl Phys 53(6):06510310.1088/1361-6463/ab5728 ↗
75. Murugapandiyan P, Mohanbabu A, Lakshmi VR, Ramakrishnan VN, Varghese A, Wasim MO, Baskaran S, Kumar RS, Janakiraman V (2020) Performance analysis of HfO2/InAlN/AlN/GaN HEMT with AlN buffer layer for high power microwave applications. J Sci: Adv Mater Devices 5(2):192–198
76. Li L, Nomoto K, Pan M, Li W, Hickman A, Miller J, Lee K, Hu Z, Bader SJ, Lee SM, Hwang JC (2020) GaN HEMTs on Si with regrown contacts and cutoff/maximum oscillation frequencies of 250/204 GHz. IEEE Electron Device Lett 41(5):689–69210.1109/LED.2020.2984727 ↗
77. Cui P, Zeng Y (2021) Electrical properties of 90-nm InAlN/GaN HEMT on silicon substrate. Phys E: Low-dimens Sys Nanostructures 134:11482110.1016/j.physe.2021.114821 ↗
78. Zhou Y, Zhu J, Mi M, Zhang M, Wang P, Han Y, Wu S, Liu J, Zhu Q, Chen Y, Hou B (2021) Analysis of low voltage RF power capability on AlGaN/GaN and InAlN/GaN HEMTs for terminal applications. IEEE J Electron Devices Soc 10(9):756–76210.1109/JEDS.2021.3103847 ↗
79. Cui P, Jia M, Chen H, Lin G, Zhang J, Gundlach L, Xiao JQ, Zeng Y (2021) InAlN/GaN HEMT on Si with fmax= 270 GHz. IEEE Trans Electron Devices 68(3):994–99910.1109/TED.2021.3049316 ↗
80. Cui P, Zeng Y (2021) Technology of sub-100 nm InAlN/GaN HEMTs on silicon with suppressed leakage current. Solid-State Electron 1(185):10813710.1016/j.sse.2021.108137 ↗
81. Cui P, Yang TY, Zhang J, Chueh YL, Zeng Y (2021) Improved On/Off current ratio and linearity of InAlN/GaN HEMTs with N2O surface treatment for radio frequency application. ECS J Solid State Sci Technol 10(6):06501310.1149/2162-8777/ac08dc ↗
82. Cui P, Zeng Y (2022) Scaling behavior of InAlN/GaN HEMTs on silicon for RF applications. Sci Rep 12(1):1668310.1038/s41598-022-21092-9 ↗
83. Charan VS, Muralidharan R, Raghavan S, Nath DN (2022) 20.2 GHz-µm fT–LG in InAlN/GaN-on-Si High electron mobility transistors. Physica Status Solidi (a). 219(21):210085810.1002/pssa.202100858 ↗
84. Zhou Y, Mi M, Yang M, Han Y, Wang P, Chen Y, Liu J, Gong C, Lu Y, Zhang M, Zhu Q (2022) High performance millimeter-wave InAlN/GaN HEMT for low voltage RF applications via regrown Ohmic contact with contact ledge structure. Appl Phys Lett 120(6):06210410.1063/5.0079359 ↗
85. Sharma M, Chaujar R (2022) Ultrascaled 10 nm T-gate E-mode InAlN/AlN HEMT with polarized doped buffer for high power microwave applications. Int J RF Microwave Comput Aided Eng 32(4):e2305710.1002/mmce.23057 ↗
86. Raychaudhuri J, Mukherjee J, Malik A, Kumar S, Rawal DS, Mishra M, Ghosh S (2023) Performance analysis of InAlN/GaN HEMT and optimization for high frequency applications. arXiv preprint: arXiv:2309.02376
87. He Y, Zhang L, Cheng Z, Li C, He J, Xie S, Wu X, Wu C, Zhang Y (2023) Scaled InAlN/GaN HEMT on sapphire with fT/fmax of 190/301 GHz. IEEE Trans Electron Devices 70(6):3001–300410.1109/TED.2023.3269728 ↗
88. Lian M, Yin Y, Li J, Zou B, Zhang K, Zhang X, Xie Y, Wu Y, Zhang Z (2023) 9 mV/V Ultra-low DIBL of suppressing SCEs in InAlN/GaN HEMT with lattice-matched InxAlyGa (1-xy) N back-barrier for RF device. Microelectron J 1(137):10582810.1016/j.mejo.2023.105828 ↗
89. Gong C, Mi M, Zhou Y, Wang P, Chen Y, Liu J, Han Y, An S, Guo S, Zhang M, Zhu Q (2023) InAlN/GaN HEMT with n+ GaN contact ledge structure for millimeter-wave low voltage applications. IEEE J Electron Devices Soc 6(11):72–7710.1109/JEDS.2023.3234695 ↗
90. Zhou Y, Mi M, Wang P, Gong C, Chen Y, Chen Z, Liu J, Yang M, Zhang M, Zhu Q, Ma X (2023) Improved RF power performance of InAlN/GaN HEMT by optimizing rapid thermal annealing process for high-performance low-voltage terminal applications. Chin Phys B 32(12):12710210.1088/1674-1056/acd8a1 ↗
91. Kumari V, Saxena M, Gupta M (2024) RF Performance augmentation using DG-InAlN/GaN HEMT. IEEE Trans Electron Devices 71(9):5289–529510.1109/TED.2024.3430251 ↗
92. Chen S, Cui P, Linewih H, Cheong KY, Xu M, Luo X, Wang L, Sun J, Dai J, Han J, Xu X (2024) Improved electrical performance of InAlN/GaN high electron mobility transistors with forming gas annealing. Solid-State Electron 1(213):10886110.1016/j.sse.2024.108861 ↗
93. Lv B, Zhang L, Mo J (2024) Asymmetric GaN high electron mobility transistors design with InAlN barrier at source side and AlGaN barrier at drain side. Electronics 13(3):65310.3390/electronics13030653 ↗
94. Guo SY, Zhu Q, Chen YL, Zhang M, Mi MH, Zhu JJ, Lei YM, An SR, Lu JN, Gong C, Ma XH (2024) Effects of spacer layer thickness in InAlN/GaN double-channel HEMTs. Semicond Sci Technol 39(6):06501410.1088/1361-6641/ad4a2d ↗
95. Xu J, Jiang L, Feng C, Xiao H (2025) The influence of AlGaN spacer thickness on the electrical properties of InAlN/AlGaN/AlN/GaN heterostructure. J Electron Mater 54(3):2315–232110.1007/s11664-024-11620-w ↗
96. Sharma M, Chaujar R (2024) Device optimization of t-shaped gate and polarized doped buffer-engineered inaln/gan hemt for improved rf/microwave performance. Arab J Sci Eng 49(7):9983–999410.1007/s13369-024-08705-3 ↗
97. Murugapandiyan P, Revathy A, Ramkumar N, Kumar RS, Mohanbabu A (2025) Comparative study of AlGaN/InGaN/β-Ga2O3 and InAlN/InGaN/β-Ga2O3 HEMTs for enhanced RF linearity. J Electron Mater 54(3):2340–235410.1007/s11664-024-11664-y ↗
98. Bindhu SH, Verma YK, Dheep GR (2025) DC and RF Performance analysis of scaled AlInN/GaN HEMTs with single and double-gate structures. Micro Nanostructures 11:20817310.1016/j.micrna.2025.208173 ↗
99. Medjdoub F, Sarazin N, Tordjman M, Magis M, di Forte-Poisson MA, Knez M, Delos E, Gaquiere C, Delage SL, Kohn E (2007) Characteristics of Al2O3/AlInN/GaN MOSHEMT. Electron Lett 43(12):691–69210.1049/el:20070425 ↗
100. Pozzovivo G, Kuzmík J, Golka S, Čičo K, Fröhlich K, Carlin JF, Gonschorek M, Grandjean N, Schrenk W, Strasser G, Pogany D (2008) Influence of GaN capping on performance of InAlN/AlN/GaN MOS-HEMT with Al2O3 gate insulation grown by CVD. Phys Status Solidi C 5(6):1956–195810.1002/pssc.200778528 ↗