journal article·2025-06-10

Review on Ferroelectricity and Atomic Characterization of Hf0.5Zr0.5O2 in FeRAM

Bowen Shen, Benjamin Yang, Mingcheng Shi, Wen Sun, Huanan Liu, Yi Ding, Bin Gao, He Qian, Yuyan Wang, Jianshi Tang, Huaqiang Wu

ACS Applied Electronic Materials· Volume 7· Issue 11
Publisher page

Abstract

Hafnia-based ferroelectric memory has drawn extensive attention for its outstanding advantages─such as BEOL compatibility and ability to aggressively scale down. Recent research has extensively investigated the material sciences behind device performance, and optimizations have been achieved in different aspects: including optimizing stack growth and phase composition, reducing the coercive electric field and imprint effect, improving polarization and endurance number, etc. The overall correlation between materials physics and device properties in hafnia-based ferroelectric memory has not been well examined. This article provides a detailed overview of various parameters related to hafnia-based ferroelectric memory, which is divided into the following parts: I. device operation and related circuits; II. aspects related to ferroelectricity, such as polarization, coercive electric field, retention, wake-up and fatigue, speed, and imprint; III. annealing temperature and phase transition; IV. interface processing, including metal electrodes and interlayers; V. atomic characterization, e.g., XRD, PFM and TEM. At the conclusion of this review, we also reviewed the current research hotspots of major memory companies and research institutions, discussed the challenges faced by ferroelectric memory devices, and proposed promising research directions for the future. We hope this article will guide researchers and inspire further studies on hafnia-based memory devices.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Ferroelectric and Negative Capacitance Devices · MXene and MAX Phase Materials · Advanced Memory and Neural Computing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Integrated Circuits

Tsinghua University

Beijing National Research Center for Information Science and Technology

Funding

Natural Science Foundation of Beijing Municipality · Tsinghua University · National Natural Science Foundation of China · Beijing Nova Program · New Cornerstone Science Foundation

References (100+)

Show source-provided references
1. Chen H. J. Y. · 2023 International Electron Devices Meeting (IEDM) · 2023 · 1
2. 10.1038/s41586-020-2208-x10.1038/s41586-020-2208-x ↗
3. Zhou, Y.; Liang, Z.; Luo, W.; Yu, M.; Zhu, R.; Lv, X.; Li, J.; Huang, Q.; Liu, F.; Tang, K.; Huang, R. Ferroelectric and Interlayer Co-Optimization with In-Depth Analysis for High Endurance FeFET. International Electron Devices Meeting (IEDM), San Francisco, CA, 2022; pp 1–4.10.1109/IEDM45625.2022.10019465 ↗
4. Kong, Q.; Liu, L.; Zheng, Z.; Sun, C.; Kumar, A.; Shao, R.; Zhou, Z.; Jiao, L.; Zhang, J.; Xu, H.; Chen, Y.; Liu, G.; Zhang, D.; Wang, X.; Nguyen, B.Y.; Gong, X. First Demonstration of BEOL-Compatible 3D Fin-Gate Oxide Semiconductor Fe-FETs. 2022 International Electron Devices Meeting (IEDM), San Francisco, CA, 2022; pp 1–4.10.1109/IEDM45625.2022.10019480 ↗
5. Yoon, S.; Hong, S.I.; Choi, G.; Kim, D.; Kim, I.; Jeon, S. M.; Kim, C.; Min, K. Highly Stackable 3D Ferroelectric NAND Devices: Beyond the Charge Trap Based Memory. 14th IEEE International Memory Workshop (IMW), Dresden, Germany, 2022; pp 1–3.10.1109/IMW52921.2022.9779278 ↗
6. Yoon S. · 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2023 · 1
7. 10.1038/s41467-020-15159-210.1038/s41467-020-15159-2 ↗
8. Chang, S.C.; Haratipour, N.; Shivaraman, S.; Brown-Heft, T. L.; Peck, J.; Lin, C.C.; Tung, I. C.; Merrill, D. R.; Liu, H.; Lin, C.Y.; Hamzaoglu, F.; Metz, M. V.; Young, I. A.; Kavalieros, J.; Avci, U. E. Anti-Ferroelectric HfxZr1-xO2 Capacitors for High-density 3-D Embedded-DRAM. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2020; pp 1–4.
9. Okuno J. · 2023 International Electron Devices Meeting (IEDM) · 2023 · 1
10. Ramaswamy N. · 2023 International Electron Devices Meeting (IEDM) · 2023 · 1
11. 10.1088/1674-4926/31/11/11500110.1088/1674-4926/31/11/115001 ↗
12. 10.1109/TED.2024.343563010.1109/TED.2024.3435630 ↗
13. Chang S. C. · 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2024 · 1
14. 10.1021/acsaelm.8b0004610.1021/acsaelm.8b00046 ↗
15. 10.34133/research.009310.34133/research.0093 ↗
16. Lederer, M.; Lehninger, D.; Abdulazhanov, S.; Reck, A.; Olivo, R.; Kaempfe, T.; Seidel, K. Process Influences on the Microstructure of BEOL Integrated Ferroelectric Hafnium Zirconium Oxide. IEEE International Symposium on Applications of Ferroelectrics (ISAF)/International Symposium on Integrated Functionalities (ISIF)/Piezoresponse Force Microscopy Workshop (PFM), Sydney, Australia, 2021; pp 1–4.10.1109/ISAF51943.2021.9477392 ↗
17. 10.1002/smtd.20240039510.1002/smtd.202400395 ↗
18. Luo, Y.; Luo, Y.C.; Yu, S. A FeRAM Based Volatile/Non-Volatile Dual-Mode Buffer Memory for Deep Neural Network Training. Design, Automation and Test in Europe Conference and Exhibition (DATE), Grenoble, France, 2021, 1871–1876.10.23919/DATE51398.2021.9474180 ↗
19. Kim T. · 2023 International Electron Devices Meeting (IEDM) · 2023 · 1
20. Mukherjee S. · 2023 International Electron Devices Meeting (IEDM) · 2023 · 1
21. 10.1126/science.aba006710.1126/science.aba0067 ↗
22. 10.1038/s41467-022-28236-510.1038/s41467-022-28236-5 ↗
23. 10.1063/1.491670710.1063/1.4916707 ↗
24. 10.1021/nl302049k10.1021/nl302049k ↗
25. 10.1109/LED.2023.331131610.1109/LED.2023.3311316 ↗
26. Haratipour, N.; Chang, S.C.; Shivaraman, S.; Neumann, C.; Liao, Y.C.; Alpizar, B. G.; Tung, I. C.; Li, H.; Kumar, V.; Doyle, B.; Atanasov, S.; Peck, J.; Kabir, N.; Allen, G.; Hoff, T.; Oni, A.; Dutta, S.; Tronic, T.; Roy, A.; Hamzaoglu, F.; Bristol, R.; Metz, M.; Young, I.; Kavalieros, J.; Avci, U. Hafnia-Based FeRAM: A Path Toward Ultra-High Density for Next-Generation High-Speed Embedded Memory. International Electron Devices Meeting (IEDM), San Francisco, CA, 2022; pp 1–4.10.1109/IEDM45625.2022.10019560 ↗
27. Lyu, X.; Si, M.; Sun, X.; Capano, M. A.; Wang, H.; Ye, P. D. Ferroelectric and Anti-Ferroelectric Hafnium Zirconium Oxide: Scaling Limit, Switching Speed and Record High Polarization Density. 39th Symposium on VLSI Technology/33rd Symposium on VLSI Circuits, Kyoto, Japan, 2019; pp 1–2.10.23919/VLSIT.2019.8776548 ↗
28. 10.1109/LED.2022.317886710.1109/LED.2022.3178867 ↗
29. 10.1063/5.003085610.1063/5.0030856 ↗
30. Tahara K. · Symposium on VLSI Technology · 2021 · 1
31. 10.1063/5.009843610.1063/5.0098436 ↗
32. 10.1080/1478643620821447110.1080/14786436208214471 ↗
33. 10.1088/1361-6528/ac189f10.1088/1361-6528/ac189f ↗
34. 10.1126/science.adf613710.1126/science.adf6137 ↗
35. Minchul S. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 1
36. Lee M. · 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2024 · 1
37. 10.1109/TED.2024.341894210.1109/TED.2024.3418942 ↗
38. 10.1109/LED.2019.291703210.1109/LED.2019.2917032 ↗
39. Hur, J.; Wang, P.; Wang, Z.; Choe, G.; Tasneem, N.; Khan, A. I.; Yu, S. Interplay of Switching Characteristics, Cycling Endurance and Multilevel Retention of Ferroelectric Capacitor. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2020; pp 1–4.10.1109/IEDM13553.2020.9372077 ↗
40. 10.1109/TED.2024.343331710.1109/TED.2024.3433317 ↗
41. Lin, Y.D.; Yeh, P.C.; Tang, Y.T.; Su, J.W.; Yang, H.Y.; Chen, Y.H.; Lin, C.P.; Yeh, P.S.; Chen, J.C.; Tzeng, P.J.; Lee, M.H.; Hou, T.H.; Sheu, S.S.; Lo, W.C.; Wu, C.I. Improving Edge Dead Domain and Endurance in Scaled HfZrOx FeRAM. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2021; pp 1–4.10.1109/IEDM19574.2021.9720692 ↗
42. 10.1002/adfm.20160059010.1002/adfm.201600590 ↗
43. Huang, H.H.; Cho, C.Y.; Lin, T.Y.; Huang, T.S.; Wu, M.H.; Wang, I. T.; Chang, Y.K.; Chou, C.H.; Liao, P.J.; Yang, H.Y.; Lin, Y.D.; Yeh, P.C.; Sheu, S.S.; Hou, T.H. Modeling Fatigue-Breakdown Dilemma in Ferroelectric Hf0.5Zr0.5O2 and Optimized Programming Strategies. International Electron Devices Meeting (IEDM), San Francisco, CA, 2022; pp 1–4.10.1109/IEDM45625.2022.10019559 ↗
44. Lee, J. H.; Chou, C. H.; Liao, P. J.; Chang, Y. K.; Huang, H. H.; Lin, T. Y.; Liu, Y. S.; Nien, C. H.; Hou, D. H.; Hou, T. H.; He, J. Investigation of Defect Engineering Toward Prolonged Endurance for HfZrO Based Ferroelectric Device. International Electron Devices Meeting (IEDM), San Francisco, CA, 2022; pp 1–4.10.1109/IEDM45625.2022.10019519 ↗
45. 10.1002/adfm.20230174610.1002/adfm.202301746 ↗
46. 10.1109/TED.2023.324357910.1109/TED.2023.3243579 ↗
47. 10.1109/JEDS.2022.314175610.1109/JEDS.2022.3141756 ↗
48. 10.1109/JEDS.2022.323040210.1109/JEDS.2022.3230402 ↗
49. Chen, J.; Qian, H.; Zhang, H.; Shen, R.; Lin, G.; Gu, J.; Jin, C.; Zhang, M.; Liu, H.; Liu, Y.; Han, G. Physical Origin of Recovable Ferroelectric Fatigue and Recovery for Doped-HfO2: Toward Endurance Immunity. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2023; pp 1–4.10.1109/IEDM45741.2023.10413825 ↗
50. 10.1021/acs.nanolett.4c0026310.1021/acs.nanolett.4c00263 ↗
51. 10.1109/LED.2024.348716910.1109/LED.2024.3487169 ↗
52. Okuno, J.; Kunihiro, T.; Konishi, K.; Maemura, H.; Shuto, Y.; Sugaya, F.; Materano, M.; Ali, T.; Kuehnel, K.; Seidel, K. SoC Compatible 1T1C FeRAM Memory Array Based on Ferroelectric Hf0.5Zr0.5O2. IEEE Symposium on VLSI Technology and Circuits, Honolulu, HI, 2020; pp 1–2.10.1109/VLSITechnology18217.2020.9265063 ↗
53. Okuno, J.; Kunihiro, T.; Konishi, K.; Maemura, H.; Shuto, Y.; Sugaya, F.; Materano, M.; Ali, T.; Lederer, M.; Kuehnel, K.; Seidel, K.; Schroeder, U.; Mikolajick, T.; Tsukamoto, M.; Umebayashi, T. High-Endurance and Low-Voltage Operation of 1T1C FeRAM Arrays for Nonvolatile Memory Application. IEEE International Memory Workshop (IMW), Dresden, Germany, 2021; pp 1–3.10.1109/IMW51353.2021.9439595 ↗
54. Francois, T.; Coignus, J.; Makosiej, A.; Giraud, B.; Carabasse, C.; Barbot, J.; Martin, S.; Castellani, N.; Magis, T.; Grampeix, H.; Van Duijn, S.; Mounet, C.; Chiquet, P.; Schroeder, U.; Slesazeck, S.; Mikolajick, T.; Nowak, E.; Bocquet, M.; Barrett, N.; Andrieu, F.; Grenouillet, L. 16kbit HfO2: Si-Based 1T-1C FeRAM Arrays Demonstrating High Performance Operation and Solder Reflow Compatibility. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2021; pp 1–4.10.1109/IEDM19574.2021.9720640 ↗
55. Higashi, Y.; Florent, K.; Subirats, A.; Kaczer, B.; Di Piazza, L.; Clima, S.; Ronchi, N.; McMitchell, S. R. C.; Banerjee, K.; Celano, U.; Suzuki, M.; Linten, D.; Van Houdt, J. New Insights Into the Imprint Effect in FE-HfO2 and its Recovery. IEEE International Reliability Physics Symposium (IRPS), Monterey, CA, 2019; pp 1–7.10.1109/IRPS.2019.8720553 ↗
56. Higashi, Y.; Ronchi, N.; Kaczer, B.; Banerjee, K.; McMitchell, S. R. C.; O’Sullivan, B. J.; Clima, S.; Minj, A.; Celano, U.; Di Piazza, L.; Suzuki, M.; Linten, D.; Van Houdt, J. Impact of Charge Trapping on Imprint and its Recovery in HfO2 Based FeFET. 65th IEEE Annual International Electron Devices Meeting (IEDM), San Francisco, CA, 2019; pp 1–4.10.1109/IEDM19573.2019.8993472 ↗
57. 10.1109/TED.2017.274254910.1109/TED.2017.2742549 ↗
58. 10.1063/5.005318510.1063/5.0053185 ↗
59. 10.1088/1674-4926/45/4/04230110.1088/1674-4926/45/4/042301 ↗
60. 10.1109/TED.2020.302584610.1109/TED.2020.3025846 ↗
61. 10.1002/pssa.20230006710.1002/pssa.202300067 ↗
62. 10.1002/aelm.20210015110.1002/aelm.202100151 ↗
63. 10.1021/acsami.9b1114610.1021/acsami.9b11146 ↗
64. 10.1002/aelm.20160050510.1002/aelm.201600505 ↗
65. 10.1007/s12274-021-4047-y10.1007/s12274-021-4047-y ↗
66. 10.1063/5.002965710.1063/5.0029657 ↗
67. 10.1109/TED.2023.332462310.1109/TED.2023.3324623 ↗
68. Xin T. · 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2022 · 1
69. 10.1109/JEDS.2023.333607710.1109/JEDS.2023.3336077 ↗
70. 10.1002/aelm.20180052210.1002/aelm.201800522 ↗
71. Chiu, C.Y.; De, S.; Cho, C.Y.; Hou, T.H. Trade-Off Between Thermal Budget and Thickness Scaling: A Bottleneck on Quest for BEOL Compatible Ultra-Thin Ferroelectric Films Sub-5nm. 8th Electron Devices Technology & Manufacturing Conference (EDTM), Bangalore, India, 2024; pp 1–3.10.1109/EDTM58488.2024.10511710 ↗
72. 10.1109/LED.2020.301926510.1109/LED.2020.3019265 ↗
73. 10.1021/acsaelm.1c0051110.1021/acsaelm.1c00511 ↗
74. Chen K. T. · 2019 Electron Devices Technology and Manufacturing Conference (EDTM) · 2019 · 1
75. 10.1021/acsaelm.0c0067110.1021/acsaelm.0c00671 ↗
76. 10.1021/acsaelm.0c0061010.1021/acsaelm.0c00610 ↗
77. 10.1109/LED.2023.324810310.1109/LED.2023.3248103 ↗
78. 10.1021/acsami.2c2226310.1021/acsami.2c22263 ↗
79. 10.1109/TED.2020.304617310.1109/TED.2020.3046173 ↗
80. 10.1109/LED.2018.284657010.1109/LED.2018.2846570 ↗
81. 10.1002/adfm.20230326110.1002/adfm.202303261 ↗
82. 10.1021/acsnano.4c0199210.1021/acsnano.4c01992 ↗
83. 10.1109/TED.2020.299844410.1109/TED.2020.2998444 ↗
84. 10.1002/adfm.20230712010.1002/adfm.202307120 ↗
85. 10.1109/TED.2021.313884310.1109/TED.2021.3138843 ↗
86. 10.1002/adfm.20220992510.1002/adfm.202209925 ↗
87. 10.1109/TED.2022.317417810.1109/TED.2022.3174178 ↗
88. 10.1109/LED.2023.333078410.1109/LED.2023.3330784 ↗
89. 10.1109/TED.2023.327780410.1109/TED.2023.3277804 ↗
90. 10.1109/TED.2023.324602810.1109/TED.2023.3246028 ↗
91. 10.1109/TED.2022.314609810.1109/TED.2022.3146098 ↗
92. 10.1109/TED.2024.344675310.1109/TED.2024.3446753 ↗
93. 10.1109/LED.2022.318524610.1109/LED.2022.3185246 ↗
94. 10.1109/TED.2021.312628310.1109/TED.2021.3126283 ↗
95. 10.1063/5.020777510.1063/5.0207775 ↗
96. Teng, L.C.; Huang, Y.C.; Wang, S.Y.; Lin, Y.H.; Chien, C.H.BEOL-Compatible Ferroelectric Capacitor with Excellent Endurance and Retention by Improving Interface Quality. International VLSI Symposium on Technology; Systems and Applications (VLSI), Hsinchu, Taiwan, 2024; pp 1–2.10.1109/VLSITSA60681.2024.10546363 ↗
97. 10.1088/1361-6641/acde9f10.1088/1361-6641/acde9f ↗
98. 10.1109/LED.2024.336822510.1109/LED.2024.3368225 ↗
99. 10.1186/s40580-022-00342-610.1186/s40580-022-00342-6 ↗
100. Ali, M. H.; Srinu, R.; Meihar, P.; Pandey, A.; Yadav, M.; Lashkare, S.; Ganguly, U. Enhanced Remnant Polarization(>70 μC/cm2) at Low Field and Low Processing Temperatures in ALD Grown Ferroelectric Hf0.5Zr0.5O2. 2022 IEEE International Conference on Emerging Electronics (ICEE), 2022; pp 1–3.10.1109/ICEE56203.2022.10117765 ↗