A review of device-level thermal management in wide and ultra-wide bandgap semiconductor devices
Source abstract
Abstract
This review systematically summarizes four device-level thermal management strategies for wide and ultra-wide bandgap semiconductors: heteroepitaxial growth, wafer bonding, microchannel cooling, and thermal vias/trenches.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Silicon Carbide Semiconductor Technologies · Advancements in Semiconductor Devices and Circuit Design · GaN-based semiconductor devices and materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Key Laboratory for Physical Electronics and Devices of the Ministry of Education, School of Electronic Science and Engineering, Xi’an Jiaotong University, No. 28, Xianning West Road, Xi’an 710049, China
Funding
National Key Research and Development Program of China
References (100+)
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