journal article·2021

Suppression of short channel effects in ferroelectric Si junctionless transistors with a sub-10 nm gate length defined by helium ion beam lithography

Teng-Jan Chang, Ting-Yun Wang, Chin-I Wang, Zheng-da Huang, Yu-Sen Jiang, Chun-Yi Chou, Wei-Chung Kao, Miin-Jang Chen

Journal of Materials Chemistry C· Volume 9· Issue 26
Publisher page

Abstract

Short channel effects in Si junctionless transistors with a gate length below 10 nm are reduced by the ferroelectric Hf 0.5 Zr 0.5 O 2 gate oxide.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short

Research context

OpenAlex topics: Ferroelectric and Negative Capacitance Devices · Semiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering

National Taiwan University

Taipei

Republic of China

Funding

Taiwan Semiconductor Manufacturing Company · Ministry of Science and Technology, Taiwan

References (47)

Show source-provided references
1. A. I. Khan , C. W.Yeung , C.Hu and S.Salahuddin , 2011 IEEE International electron devices meeting (IEDM) IEEE, 2011, pp. 11.3.1–11.3.4
2. M. Lee , P.-G.Chen , C.Liu , K.Chu , C.-C.Cheng , M.-J.Xie , S.-N.Liu , J.-W.Lee , S.-J.Huang and M.-H.Liao , 2015 IEEE International electron devices meeting (IEDM), IEEE, 2015, pp. 22.5.1–22.5.4
3. Kwon · IEEE Electron Device Lett. · 2019 · 40 · 99310.1109/LED.2019.2912413 ↗
4. Kim · Appl. Phys. Lett. · 2017 · 111 · 24290110.1063/1.4995619 ↗
5. Kim · Appl. Phys. Lett. · 2018 · 112 · 17290210.1063/1.5026715 ↗
6. Khan · Nat. Mater. · 2015 · 14 · 18210.1038/nmat4148 ↗
7. S. Salahuddin and S.Datta , 2008 IEEE International Electron Devices Meeting, IEEE, 2008, pp. 1–4
8. Salahuddin · Nano Lett. · 2008 · 8 · 40510.1021/nl071804g ↗
9. M. Lee , S.-T.Fan , C.-H.Tang , P.-G.Chen , Y.-C.Chou , H.-H.Chen , J.-Y.Kuo , M.-J.Xie , S.-N.Liu and M.-H.Liao , 2016 IEEE International Electron Devices Meeting (IEDM), IEEE, 2016, pp. 12.1.1–12.1.4
10. Lee · IEEE Electron Device Lett. · 2015 · 36 · 29410.1109/LED.2015.2402517 ↗
11. W. Chung , M.Si , P. R.Shrestha , J. P.Campbell , K. P.Cheung and D. Y.Peide , 2018 IEEE Symposium on VLSI Technology, IEEE, 2018, pp. 89–90
12. D. C. Joy , Helium Ion Microscopy: Principles and Applications , Springer , 201310.1007/978-1-4614-8660-2 ↗
13. Shi · Microelectron. Eng. · 2016 · 155 · 7410.1016/j.mee.2016.02.045 ↗
14. Inai · J. Electron Microsc. · 2007 · 56 · 16310.1093/jmicro/dfm024 ↗
15. Morgan · Microsc. Today · 2006 · 14 · 2410.1017/S1551929500050240 ↗
16. Hlawacek · J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom. · 2014 · 32 · 020801
17. M. Stepanova and S.Dew , Nanofabrication: Techniques and Principles , Springer Science & Business Media , 2011
18. Ravi Kiran · ACS Appl. Electron. Mater. · 2020 · 2 · 380510.1021/acsaelm.0c00627 ↗
19. Lewis · Nano Lett. · 2019 · 19 · 604310.1021/acs.nanolett.9b01911 ↗
20. Kumar · ACS Appl. Mater. Interfaces · 2020 · 12 · 1961610.1021/acsami.9b21414 ↗
21. Cattoni · Microelectron. Eng. · 2018 · 193 · 1810.1016/j.mee.2018.02.015 ↗
22. Livengood · J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom. · 2009 · 27 · 324410.1116/1.3237101 ↗
23. Emmrich · Appl. Phys. Lett. · 2016 · 108 · 16310310.1063/1.4947277 ↗
24. Grigorescu · Nanotechnology · 2009 · 20 · 29200110.1088/0957-4484/20/29/292001 ↗
25. Luo · RSC Adv. · 2020 · 10 · 838510.1039/C9RA08977B ↗
26. Namatsu · J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom. · 1998 · 16 · 6910.1116/1.589837 ↗
27. Müller · Appl. Phys. Lett. · 2011 · 99 · 11290110.1063/1.3636417 ↗
28. Naganuma · Appl. Phys. Express · 2008 · 1 · 06160110.1143/APEX.1.061601 ↗
29. Muller · Nano Lett. · 2012 · 12 · 431810.1021/nl302049k ↗
30. P. Sharma , K.Tapily , A.Saha , J.Zhang , A.Shaughnessy , A.Aziz , G.Snider , S.Gupta , R.Clark and S.Datta , Symposium on VLSI Technology , IEEE , 2017 , pp. T154–T155
31. Sharma · IEEE Electron Device Lett. · 2017 · 39 · 27210.1109/LED.2017.2782261 ↗
32. Hoffmann · J. Appl. Phys. · 2018 · 123 · 18410110.1063/1.5030072 ↗
33. Obradovic · IEEE Trans. Electron Devices · 2018 · 65 · 515710.1109/TED.2018.2868479 ↗
34. Landau · Dokl. Akad. Nauk SSSR · 1954 · 96 · 469
35. Chang · Phys. Rev. Appl. · 2018 · 9 · 01401010.1103/PhysRevApplied.9.014010 ↗
36. Khan · IEEE Electron Device Lett. · 2015 · 37 · 11110.1109/LED.2015.2501319 ↗
37. Kwon · IEEE Electron Device Lett. · 2017 · 39 · 30010.1109/LED.2017.2787063 ↗
38. Si · Nat. Electron. · 2019 · 2 · 58010.1038/s41928-019-0338-7 ↗
39. Xiao · IEEE Electron Device Lett. · 2019 · 40 · 71410.1109/LED.2019.2903641 ↗
40. M. Jerry , J. A.Smith , K.Ni , A.Saha , S.Gupta and S.Datta , 2018 76th Device Research Conference (DRC), IEEE, 2018, pp. 1–2
41. Veeraraghavan · IEEE Trans. Electron Devices · 1989 · 36 · 52210.1109/16.19963 ↗
42. V. P.-H. Hu , P.-C.Chiu , A. B.Sachid and C.Hu , 2017 IEEE International Electron Devices Meeting (IEDM), IEEE, 2017, pp. 23.1.1–23.1.4
43. Gupta · IEEE Electron Device Lett. · 2020 · 41 · 47310.1109/LED.2020.2969210 ↗
44. Khan · Appl. Phys. Lett. · 2017 · 111 · 25350110.1063/1.5006958 ↗
45. Jo · Curr. Appl. Phys. · 2015 · 15 · 35210.1016/j.cap.2014.12.029 ↗
46. A. Rusu , G. A.Salvatore , D.Jimenez and A. M.Ionescu , 2010 international electron devices meeting, IEEE, 2010, pp. 16.3.1–16.3.4
47. Cheng · Commun. Phys. · 2019 · 2 · 110.1038/s42005-018-0096-2 ↗