journal article·2018-02-20Open access

Ultra-low contact resistance in graphene devices at the Dirac point

Luca Anzi, Aida Mansouri, Paolo Pedrinazzi, Erica Guerriero, Marco Fiocco, Amaia Pesquera, Alba Centeno, Amaia Zurutuza, Ashkan Behnam, Enrique A Carrion, Eric Pop, Roman Sordan

2D Materials· Volume 5· Issue 2

Abstract

Contact resistance is one of the main factors limiting performance of short-channel graphene field-effect transistors (GFETs), preventing their use in low-voltage applications. Here we investigated the contact resistance between graphene grown by chemical vapor deposition (CVD) and different metals, and found that etching holes in graphene below the contacts consistently reduced the contact resistance, down to 23 m with Au contacts. This low contact resistance was obtained at the Dirac point of graphene, in contrast to previous studies where the lowest contact resistance was obtained at the highest carrier density in graphene (here 200 m was obtained under such conditions). The 'holey' Au contacts were implemented in GFETs which exhibited an average transconductance of 940 S m−1 at a drain bias of only 0.8 V and gate length of 500 nm, which out-perform GFETs with conventional Au contacts.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Graphene research and applications · Quantum and electron transport phenomena · Advancements in Semiconductor Devices and Circuit Design

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (29)

Show source-provided references
1. 10.1021/acsnano.7b0387810.1021/acsnano.7b03878 ↗
2. 10.1109/LED.2011.215502410.1109/LED.2011.2155024 ↗
3. 10.1016/j.diamond.2012.01.01910.1016/j.diamond.2012.01.019 ↗
4. 10.1063/1.471957910.1063/1.4719579 ↗
5. 10.1109/LED.2011.217315410.1109/LED.2011.2173154 ↗
6. 10.1063/1.480464310.1063/1.4804643 ↗
7. 10.1021/nn400671z10.1021/nn400671z ↗
8. 10.1126/science.124435810.1126/science.1244358 ↗
9. 10.1021/nn405834b10.1021/nn405834b ↗
10. 10.1007/s12274-014-0656-z10.1007/s12274-014-0656-z ↗
11. 10.1002/adma.20150371510.1002/adma.201503715 ↗
12. Lai R · Int. Electron Devices Meeting · 2007 · 609
13. 10.1038/nnano.2011.610.1038/nnano.2011.6 ↗
14. Nagashio K · Japan. J. Appl. Phys. · 2011 · 5010.7567/JJAP.50.070108 ↗
15. 10.1021/nl301079r10.1021/nl301079r ↗
16. Schroder D K · Semiconductor Material and Device Characterization · 2006
17. 10.1021/nn401933v10.1021/nn401933v ↗
18. 10.1039/C5NR01126D10.1039/C5NR01126D ↗
19. 10.1038/s41598-017-02541-210.1038/s41598-017-02541-2 ↗
20. Miyazaki H · Semicond. Sci. Technol. · 2010 · 2510.1088/0268-1242/25/3/034008 ↗
21. 10.1002/smll.20110214110.1002/smll.201102141 ↗
22. 10.1021/nn301199j10.1021/nn301199j ↗
23. 10.1021/nn503608710.1021/nn5036087 ↗
24. 10.1109/IEDM.2016.783835510.1109/IEDM.2016.7838355 ↗
25. 10.1109/IEDM.2009.542429710.1109/IEDM.2009.5424297 ↗
26. 10.1063/1.487673810.1063/1.4876738 ↗
27. 10.1021/acs.nanolett.6b0130910.1021/acs.nanolett.6b01309 ↗
28. 10.1039/C4FD00073K10.1039/C4FD00073K ↗
29. 10.1016/j.carbon.2014.03.06010.1016/j.carbon.2014.03.060 ↗