CIGS Mini‐Modules with Dispensed Metallization on Transparent Conductive Oxide Layer

This article presents the application of a parallel dispensing device for low‐temperature silver paste metallization on transparent conductive oxide (TCO) layers of Cu(In_{1 − x}Ga_x)Se₂ (CIGS) substrates as an alternative metallization technology to screen printing and inkjet printing. A curing variation experiment is performed to analyze the effect of different curing conditions on the resulting contact resistivity of the metal grid. Contact resistivity values below 5 mΩcm² are achieved. Furthermore, CIGS mini‐modules are metallized with three different low‐temperature paste formulations obtaining a record core finger geometry of 25 μm and an average optical aspect ratio of 0.46 using 25 μm nozzle openings. The dispensed metal grid on the TCO layers achieves the comparable current density values of j_sc = 32.2 mA cm⁻² and the open‐circuit voltages values per cell of V_oc = 672 mV as the screen printed metal grid on CIGS mini‐modules and, hence, a nominal power of 2.05 W. The metal grid enables the use of broader cell widths compared with grid‐free CIGS samples and results in a reduced dead area.