article·2008-01-01Open access

Research on preparation of BaTiO_3/epoxy dielectric composites

Dingquan Xiao

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Abstract

In this work,epoxy resin was chosen as polymer matrix,dicyandiamide and 2-ethyl-4-methyl imidazole as curing system and BaTiO3,which particle sizes are in the range of 38.0nm to 2.67μm,as high dielectric filler component.BaTiO3/epoxy 0-3 composite films with different BaTiO3 content were fabricated by solution blending and spin coating method.The curing processes were analyzed and the XRD and microstructure of the composites were analyzed.The results show that the curing temperature is about 120℃(1h) for curing agent is in the amount of 6wt% of epoxy.The addition of BaTiO3 particles has destroyed the ordered molecular structure of epoxy resin and reduced array density of epoxy molecular chain.When the mass fraction of BaTiO3 is 0.6,the distribution of BaTiO3 powder and the dielectric properties of the composites are in optimization.
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Research context

OpenAlex topics: Synthesis and properties of polymers · Silicone and Siloxane Chemistry · Epoxy Resin Curing Processes

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