Preparation of SiC particulate reinforced 356Al matrix composite for electronic packaging and its thermal expansion performance

SiCp/356Al composite was prepared by pressureless infiltration. The microstructure and phases of SiCp/356Al composite was investigated by means of scanning electron microscope(SEM) and X-ray diffraction(XRD). The coefficient of thermal expansion (CTE) of SiCp/356Al composite was measured in the temperature interval of 50～400℃.The influence factors on thermal expansion performance were analyzed. The results show that the distribution of particulates in SiCp/356Al composite is homogeneous. No new phase appears in the composite. The CTE of the composite decreases apparently by comparison with the CTE of its matrix alloy. The influence of thermal stress on the CTE of the composite depends on temperature range.