Laser removal of silicon solar cell backsheet while preserving tempered glass and silicon wafer

The rapid increase of end-of-life (EoL) crystalline silicon (c-Si) photovoltaic (PV) modules poses major recycling challenges. Conventional approaches such as pyrolysis, solvent dissolution, and hot-knife delamination are slow, energy-intensive, involve chemicals, or are destructive to polymer integrity. Here, we demonstrate a continuous-wave infrared laser process at 1070 nm wavelength that enables complete backsheet removal across the entire mini-panel without cracking the tempered glass or breaking the silicon wafer. The removal of a thick backsheet is highly important in the photovoltaic recycling process. Systematic studies across laser fluence levels of 23 to 33 W/cm2 revealed an optimum at 28 W/cm2, enabling delamination of a few cm2 area each step within 8–12 s, with no wafer cracking, warping, or polymer degradation. Raman spectroscopy confirmed preservation of the crystalline silicon properties, while I–V measurements showed no loss in device performance. FTIR and Raman analyses of the recovered backsheet verified the chemical integrity at an optimum laser fluence of 28 W/cm2, in contrast to decomposition at higher fluences. This IR-CW laser route provides a fast, energy-efficient, and non-destructive pathway for backsheet recovery, offering a scalable and environmentally benign alternative to existing PV recycling methods.