Direct Tensile Testing of Free‐Standing Ultrathin Polymer Films on Liquid Surface at High Temperature
Source abstract
Abstract
Abstract The fragile nature of ultrathin polymer films poses a challenge for precise mechanical property measurements in a free‐standing state, despite their critical importance for the fabrication and performance of advanced electronic devices under thermal loading. Here, a novel high‐temperature tensile testing method for free‐standing ultrathin polymer films using a film on heated liquid (FOHL) platform is proposed. Glycerol is chosen for the thermally stable liquid platform for its high surface tension, high boiling point, miscibility with water, and chemical stability. A defect healing process of the specimen on the heated liquid effectively eliminates preexisting defects of the brittle polymer sample, enabling precise tensile property measurements at elevated temperatures. The methodology is validated through experiments on polystyrene (PS) films of varying thicknesses (50–400 nm) at elevated temperatures of 25–100 °C, demonstrating the influence of temperature and thickness on tensile properties. Decreasing elastic modulus with increasing temperature and decreasing thickness of ultrathin PS films is accurately measured. The proposed method provides a reliable method todirectly evaluate the tensile properties of ultrathin films in high‐temperature conditions.
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Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Surface Modification and Superhydrophobicity · Nanofabrication and Lithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Advanced Packaging Integration Center Korea Institute of Industrial Technology (KITECH) 156 Gaetbeol‐ro, Yeonsu‐gu Incheon 21999 Republic of Korea
Agency for Defense Development P.O. Box 35, Yuseong‐gu Daejeon 34186 Republic of Korea
Department of Mechanical Engineering Korea Advanced Institute of Science and Technology (KAIST) 291 Daehak‐ro, Yuseong‐gu Daejeon 34141 Republic of Korea
Funding
Ministry of Science and ICT, South Korea
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