3D Ag@C Cloth for Stable Anode Free Sodium Metal Batteries
Source abstract
Abstract
Abstract While sodium metal anodes (SMAs) feature many performance advantages in sodium ion batteries (SIBs), severe safety concerns remain for using bulk sodium electrodes. Herein, a 3D Ag@C natrophilic substrate prepared by a facile thermal evaporation deposition method, which can be employed as a much safer “anode‐free” SMA, is reported. Initially, there is no bulk sodium on the Ag@C substrate in the assembled SIBs. Upon charging, sodium will be uniformly deposited onto the Ag@C substrate and afterwards functions as a real SMA, thus inheriting the intrinsic merits of SMA and enhancing safety simultaneously. While cycling, the as‐synthesized substrate demonstrates superior sodium plating/stripping cycling stability at 1, 2 and 3 mA cm−2 with a capacity of 2 mAh cm−2. Theoretical simulations reveal that Na ions prefer to bind with Ag and form a Na‐Ag network, thus clearly revealing uniform sodium deposition on the Ag@C substrate. More importantly, a full battery based on Ag@C and Prussian white with impressive Coulomb efficiency (CE), high rate capability (from 0.1 C to 5 C) and long‐term cycling life is illustrated for the first time, thus making Ag@C feasible for the establishment of “anode‐free” SIBs with reduced cost, high gravimetric/volumetric energy density and enhanced safety.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advancements in Battery Materials · Advanced Battery Materials and Technologies · Inorganic Chemistry and Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Center of Super‐Diamond and Advanced Films (COSDAF) and Department of Chemistry City University of Hong Kong Hong Kong SAR 999077 P. R. China
Key Laboratory of Material Physics of Ministry of Education School of Physics and Microelectronics Zhengzhou University Zhengzhou 450052 China
School of Materials Science and Engineering Hefei University of Technology Hefei Anhui 230009 P. R. China
Funding
University of Hong Kong · Innovation and Technology Commission
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