A physics-based VLSI interconnect model including substrate and conductor skin effects

The goal of this work was to model the influence of the substrate and conductor skin effects on the RL line characteristics of on-chip interconnects. The proposed modelling approach is based on the skin-effect theory results for rectangular wires and the complex integration technique for perturbation series per unit length impedance of silicon substrate. It is shown that the calculated frequency-dependent distributed inductance and the associated resistance are in good agreement with the results obtained from rigorous full-wave solutions and CAD-oriented analytic modelling technique.