Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density
Source abstract
Abstract
Abstract Solder joints between semiconductors and a printed circuit board may fail due to temperature change or vibration. To assess the durability of solder joints a mechanical fatigue test was conducted instead of a thermal cycling test, and a resistance change was monitored to detect a failure at real time. Fatigue tests were conducted for five different semiconductors at three different frequencies, temperatures and displacements, and a fatigue life prediction equation with consideration of frequency, temperature and cracking energy density was proposed. It was shown that all the fatigue test data could be represented appropriately by the prediction equation.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (24)
Show source-provided references
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