journal article·2017-01

Novel shock wave excitation method for dynamic characterization of microstructures

Dongsheng She, Yiliu Yang, Zefei Wei, Kun Li, Zhen Yu, Feng Ding

Microsystem Technologies· Volume 23· Issue 1
Publisher page

Abstract

A novel shock wave excitation method for dynamic characterization of MEMS microstructures was proposed. A typical shock wave excitation device mainly includes a needle electrode, a plate electrode, a high-voltage capacitor, a base structure and a feeder. The principle of this method is as follows. The testing microstructure was installed on the surface of the base structure supported by a rigid platform. The plate electrode was attached on the opposite surface. The needle electrode was mounted on the feeder. Adjusting the feeder, the shock wave will be generated as soon as the gap distance between two electrodes meets the requirements of electrical discharging. The base structure will be impacted by the shock wave. Thus the testing microstructure will be excited by the movement of the base structure. A dynamic measurement system for microcantilevers were developed. In the system, the shock wave excitation device was used to excite the testing microcantilevers. T-shaped piezoresistive microcantilevers were fabricated to get the vibration response. The experiments on the dynamic characteristics measurement for microcantilevers were carried out. The results show the shock wave excitation method is effective for MEMS dynamic characterization.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Advanced MEMS and NEMS Technologies · Mechanical and Optical Resonators · Force Microscopy Techniques and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (21)

Show source-provided references
1. Burdess JS, Harris AJ, Wood D, Pitcher RJ, Glennie D (1997) A system for the dynamic characterization of microstructures. J Microelectromech Syst 6(4):322–328. doi: 10.1109/84.65012910.1109/84.650129 ↗
2. Castellini P, Martarelli M, Tomasini EP (2006) Laser Doppler vibrometry: development of advanced solutions answering to technology’s needs. Mech Syst Signal Process 20(6):1265–1285. doi: 10.1016/j.ymssp.2005.11.01510.1016/j.ymssp.2005.11.015 ↗
3. Davis CQ, Freeman DM (1998) Using a light microscope to measure motions with nanometer accuracy. Opt Eng 37(4):1299–1304. doi: 10.1117/1.60196710.1117/1.601967 ↗
4. Flynn EB, Bassman LC, Smith TP, Lalji Z, Fullerton LH, Leung TC, Koskelo AC (2006) Three-wavelength electronic speckle pattern interferometry with the Fourier-transform method for simultaneous measurement of microstructure-scale deformations in three dimensions. Appl Opt 45(14):3218–3225. doi: 10.1364/AO.45.00321810.1364/AO.45.003218 ↗
5. Hart MR, Conant R, Lau KY, Muller RS (2000) Stroboscopic interferometer system for dynamic MEMS characterization. J Microelectromech Syst 9(4):409–418. doi: 10.1109/84.89676110.1109/84.896761 ↗
6. Hu X, Hu C, Chen Z, Guo T, Hu X (2007) Measuring in-plane and out-of-plane coupled motions of microstructures by stroboscopic microscopic interferometry. Opt Laser Technol 39(6):1176–1182. doi: 10.1016/j.optlastec.2006.08.01310.1016/j.optlastec.2006.08.013 ↗
7. Kanel GI, Razorenov SV, Fortov VE (2004) Shock-wave phenomena and the properties of condensed matter. Springer, New York. doi: 10.1007/978-1-4757-4282-410.1007/978-1-4757-4282-4 ↗
8. Kang X, Tay CJ, Quan C, He XY (2007) Dynamic characterization of MEMS structures by ultrasonic wave excitation. J Micromech Microeng 17(12):2426–2431. doi: 10.1088/0960-1317/17/12/00610.1088/0960-1317/17/12/006 ↗
9. Kim P, Bae S, Seok J (2012) Resonant behaviors of a nonlinear cantilever beam with tip mass subject to an axial force and electrostatic excitation. Int J Mech Sci 64(1):232–257. doi: 10.1016/j.ijmecsci.2012.06.00810.1016/j.ijmecsci.2012.06.008 ↗
10. Kon S, Oldham K, Horowitz R (2007) Piezoresistive and piezoelectric MEMS strain sensors for vibration detection. In: The 14th international symposium on: smart structures and materials and nondestructive evaluation and health monitoring, 2007: 65292V–65292V-11. doi: 10.1117/12.71581410.1117/12.715814 ↗
11. Littrell R, Grosh K (2012) Modeling and characterization of cantilever-based MEMS piezoelectric sensors and actuators. J Microelectromech Syst 21(2):406–413. doi: 10.1109/JMEMS.2011.217441910.1109/JMEMS.2011.2174419 ↗
12. Lu QH, Zhang XM, Fan YB (2009) Robust multiscale method for in-plane micro-motion measurement based on computer micro-vision. Chin J Mech Eng 45(2):164–169. doi: 10.3901/JME.2009.02.16410.3901/JME.2009.02.164 ↗
13. Partridge A, Reynolds JK, Chui BW et al (2000) A high-performance planar piezoresistive accelerometer. J Microelectromech Syst 9(1):58–66. doi: 10.1109/84.82577810.1109/84.825778 ↗
14. Rassweiler JJ, Knoll T, Köhrmann KU et al (2011) Shock wave technology and application: an update. Eur Urol 59(5):784–796. doi: 10.1016/j.eururo.2011.02.03310.1016/j.eururo.2011.02.033 ↗
15. Read DT (1998) Young’s modulus of thin films by speckle interferometry. Meas Sci Technol 9(4):676. doi: 10.1088/0957-0233/9/4/01610.1088/0957-0233/9/4/016 ↗
16. Sharma A, Mukhiya R, Kumar SS, Gopal R, Pant BD (2014) Dynamic characterization of bulk micromachined accelerometer using laser doppler vibrometer (LDV). Microsyst Technol 9:1–12. doi: 10.1007/s00542-014-2316-310.1007/s00542-014-2316-3 ↗
17. Shi HC, Fan SC, Zhang YW, Sun JH (2015) Nonlinear dynamics study based on uncertainty analysis in electro-thermal excited MEMS resonant sensor. Sens Actuators A 232:103–114. doi: 10.1016/j.sna.2015.05.01610.1016/j.sna.2015.05.016 ↗
18. Wang XD, Li N, Wang T, Liu MW, Wang LD (2007) Dynamic characteristic testing for MEMS micro-devices with base excitation. Meas Sci Technol 18(6):1740–1747. doi: 10.1088/0957-0233/18/6/S1210.1088/0957-0233/18/6/S12 ↗
19. Wilson CJ, Bogy DB (1996) An experimental modal analysis technique for miniature structures. J Vib Acoust 118:1–9. doi: 10.1115/1.288962910.1115/1.2889629 ↗
20. Xiong X, Wu YLD, Jone WB (2005) A dual-mode built-in self-test technique for capacitive MEMS devices. IEEE Trans Instrum Meas 54(5):1739–1750. doi: 10.1109/TIM.2005.85509410.1109/TIM.2005.855094 ↗
21. Xiong L, Zhou Q, Wu Y, Chen P (2015) New laser excitation method for modal analysis of microstructure. Mech Syst Signal Process 50:227–234. doi: 10.1016/j.ymssp.2014.05.01210.1016/j.ymssp.2014.05.012 ↗