Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations
Source abstract
Abstract
We investigate the role of an Ag interlayer to suppress Kirkendall void formation in Ti/Ni surface finishes on the die-attached joints during harsh thermal aging tests at 250 °C. GaN dies were attached to the Ti/Ag/Ni sputtered direct bonded aluminum (DBA) and Ti/Ni sputtered DBA substrate using a high-temperature soldering, respectively. Without the Ag interlayer, void size increased to 0.69 µm after 1000 h of aging, but with the Ag interlayer, it reduced to 0.0794 µm. The Ag interlayer retards the development of cracks and void coalescing by controlling the diffusion rate between Ni/Sn at the bonding interface during thermal aging.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (73)
Show source-provided references
1. Thermo-mechanical fatigue induced unexpected strain hardening of Cu clip wiring on transfer-mold type EV power modules10.1016/j.ijfatigue.2023.107603 ↗
2. Power cycling tests under driving ΔTj = 125 ◦C on the Cu clip bonded EV power module10.1016/j.microrel.2022.114652 ↗
3. A review: energy storage system and balancing circuits for electric vehicle application10.1049/pel2.12013 ↗
4. Development and performance characterization of an electric ground vehicle with independently actuated in-wheel motors10.1016/j.jpowsour.2010.11.160 ↗
5. In-wheel motor drive systems for electric vehicles: state of the art, challenges, and future trends10.3390/en16073121 ↗
6. Review of electric vehicle energy storage and management system: Standards, issues, and challenges10.1016/j.est.2021.102940 ↗
7. In-wheel motor vibration control for distributed-driven electric vehicles: a review10.1109/TTE.2021.3074970 ↗
8. Thermal analysis of brake disc of an automobile10.1088/1757-899X/1116/1/012146 ↗
9. Effect of contact geometry on temperature field distribution and thermal buckling of an in-wheel disc brake system10.1080/14484846.2021.1958992 ↗
10. Cooling performance of 25 kW in-wheel motor for electric vehicles10.1007/s12239-013-0060-9 ↗
11. Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release
12. Self-healing of cracks in Ag joining layer for die-attachment in power devices10.1063/1.4962333 ↗
13. Bonding technology based on solid porous Ag for large area chips10.1016/j.scriptamat.2017.11.035 ↗
14. A survey of wide bandgap power semiconductor devices10.1109/TPEL.2013.2268900 ↗
15. Online thermal resistance and reliability characteristic monitoring of power modules with Ag sinter joining and Pb, Pb-free solders during power cycling test by SiC TEG chip10.1109/TPEL.2020.3031670 ↗
16. Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size10.1016/j.matdes.2018.11.062 ↗
17. Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications10.1016/j.apsusc.2020.146060 ↗
18. Reliability of Ag sinter-joining die attach under harsh thermal cycling and power cycling tests10.1007/s11664-021-09221-y ↗
19. Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure10.1016/j.microrel.2018.07.044 ↗
20. Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti / Ag metallization by using micron / submicron Ag sinter paste10.7567/1347-4065/ab0278 ↗
21. Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices10.1016/j.actamat.2017.02.065 ↗
22. Effect of electroplated Au layer on bonding performance of Ag pastes10.1016/j.jallcom.2017.09.279 ↗
23. Low-temperature and pressureless sinter joining of Cu with micron / submicron Ag particle paste in air10.1016/j.jallcom.2018.11.251 ↗
24. Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size10.1016/j.apsusc.2019.04.228 ↗
25. Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint10.1007/s10854-019-02563-8 ↗
26. High-temperature lead-free solders: Properties and possibilities10.1007/s11837-009-0013-y ↗
27. Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology10.1007/s11664-003-0241-9 ↗
28. Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders10.1016/S1359-6462(03)00486-X ↗
29. Suppressing Ni-Sn-P growth in SnAgCu/Ni-P solder joints10.1016/j.scriptamat.2006.08.062 ↗
30. Reaction kinetics of Ni/Sn soldering reaction10.1016/j.actamat.2010.01.027 ↗
31. Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems10.1016/j.jallcom.2017.08.178 ↗
32. Growth Kinetics of Ni3Sn4 in the Solid–Liquid Interfacial Reaction10.1007/s11661-019-05259-0 ↗
33. Thermally stable Ni/Au–Sn/Ni joint fabricated via transient liquid-phase bonding10.1016/j.msea.2019.138738 ↗
34. Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits10.1007/s11664-015-3925-z ↗
35. Cross-interaction between Ni and Cu across Sn layers with different thickness10.1007/s11664-007-0235-0 ↗
36. Multi-principal-element products enhancing Au–Sn-bonded joints10.1016/j.jallcom.2020.157015 ↗
37. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders10.1016/j.apsusc.2023.157219 ↗
38. NiSn 4 formation during the solidification of Sn-Ni alloys10.1016/j.intermet.2012.02.010 ↗
39. Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability
40. Kirkendall voids at Cu/solder interface and their effects on solder joint reliability
41. High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni (P) metallization
42. 3D microstructure and anti-oxidation behavior of porous CoAl intermetallic fabricated by rapid thermal explosion10.1016/j.corsci.2022.110715 ↗
43. Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules10.1007/s10854-020-02930-w ↗
44. Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating10.1016/j.apsusc.2019.143797 ↗
45. Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses10.1007/s10853-021-05924-z ↗
46. Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions10.1016/j.intermet.2006.08.003 ↗
47. Thermostable Ag die-attach structure for high-temperature power devices10.1007/s10854-015-3894-2 ↗
48. Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish10.1007/s10854-019-02415-5 ↗
49. Micron-sized Ag flake particles direct die bonding on electroless Ni–P-finished DBC substrate: low-temperature pressure-free sintering, bonding mechanism and high-temperature aging reliability10.1007/s10854-019-02636-8 ↗
50. High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates
51. Thermal stability of silver paste sintering on coated copper and aluminum substrates10.1007/s11664-017-5857-2 ↗
52. Addition of SiC particles to Ag die-attach paste to improve high-temperature stability; grain growth kinetics of sintered porous Ag10.1007/s11664-015-3919-x ↗
53. Thermodynamic Re-assessment of the Ag–Ni–Sn system
54. A model for allloying effects in ferromagnetic metals10.1016/0364-5916(78)90011-1 ↗
55. Coating degradation in hot press forming10.2355/isijinternational.50.561 ↗
56. Condensation and growth of Kirkendall voids in intermetallic compounds10.1109/TCAPT.2008.2010057 ↗
57. Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints10.1016/S0921-5107(98)00313-4 ↗
58. A simple yet general model of binary diffusion coefficients emerged from a comprehensive assessment of 18 binary systems10.1016/j.actamat.2021.117077 ↗
59. Mechanisms and solutions to the brittle solder joint in electroless Ni plating10.1016/j.microrel.2016.08.006 ↗
60. Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes10.1016/j.jallcom.2016.02.027 ↗
61. Ni-Re (Nickel-Rhenium) system10.1007/BF02880520 ↗
62. A new investigation of the system Ni-Sn10.1016/j.intermet.2006.10.045 ↗
63. Phase equilibria in the system Ag – Ni – Sn: thermal behavior10.1016/j.actamat.2007.09.005 ↗
64. Phase Equilibria in the Ag-Ni-Sn system: isothermal sections10.1007/s11664-007-0205-6 ↗
65. Thermodynamic assessment of phase equilibria in the Sn-Ag-Ni system with key experimental verification10.1007/s11664-007-0361-8 ↗
66. First-principles calculations on physical properties of Ni3Snx binary system intermetallic compounds and Ni/Ni3Sn interfaces in Nickel-Tin TLPS bonding layer10.1016/j.intermet.2018.07.005 ↗
67. Suppression effect of Ni grain size on the Ni3Sn4 growth at the Sn/Ni interface10.1016/j.matchar.2017.04.013 ↗
68. Transient thermal analysis of the thermal management of high-power fast charging module using phase change material10.1016/j.egyr.2022.12.055 ↗
69. Thermal and electrical properties of copper-tin and nickel-tin intermetallics10.1063/1.351487 ↗
70. Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration10.1016/j.jallcom.2016.03.020 ↗
71. Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn10.1016/j.intermet.2017.08.002 ↗
72. Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films10.1016/j.msea.2005.12.038 ↗
73. Thermodynamic descriptions of the binary Ni–Sn and ternary Cu–Ni–Sn systems over entire composition range: a revisit