A Novel Method for Measuring the Thermal Conductivity of Electrodeposited Gold Films
Source abstract
Abstract
A simple method for determining the thermal conductivity, , of electrodeposited gold films is described. Specifically, it is shown how a comparison of the resistance‐temperature and resistance‐current characteristics of a ribbon of the film leads to a unique determination of . When applied to a film typical of those used in semiconductor device heat sink structures, the technique yields a value of , as compared to the value for bulk gold of 3.15 W/cm‐°K.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Surface and Thin Film Phenomena · Copper Interconnects and Reliability · Semiconductor materials and devices
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Affiliations
Varian Associates, Incorporated, Corporate Solid State Laboratory, Palo Alto, California 94303
References
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