Nanomaterials and Equipment for Chemical–Mechanical Polishing of Single-Crystal Sapphire Wafers
Source abstract
Abstract
Single-crystal sapphire (α-Al2O3) has been widely used in semiconductor, optics, communication, national defense, and other fields. Before application, an ultra-smooth surface which is scratch free and subsurface damage free is essential. Furthermore, the sapphire has unique qualities such as significant rigidity and chemical stability, which make it extremely arduous to process. Chemical mechanical polishing (CMP) is recognized as the final process to reduce the roughness and eliminate surface defects of a sapphire surface. In this review, the materials and equipment used for the chemical polishing of a sapphire wafer are summarized, and the surface nanoscale changes of sapphire wafer are reviewed from the angles of regulating polishing-process parameters, composition of polishing slurry including that which is nano-abrasive, a pH regulator, a complexing agent, and other additives, as well as hybrid CMP technologies. The outlook and future applications are also summarized.
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Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Integrated Circuits and Semiconductor Failure Analysis · Diamond and Carbon-based Materials Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Hubei Sinophorus Electronic Materials Co., Ltd., Xiaoting Avenue 66-3#, Xiaoting District, Yichang 443007, China
The Key Laboratory of Advanced Ceramics and Machining Technology by the Ministry of Education of China, School of Materials Science & Engineering, Tianjin University, Tianjin 300072, China
Funding
National Key Research and Development Plan Project
References (100+)
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