Local Stress Field in Wafer Thinning Simulations with Phase Space Averaging
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Abstract
From an ingot to a wafer then to a die, wafer thinning plays an important role in the semiconductor industry. To reveal the material removal mechanism of semiconductor at nanoscale, molecular dynamics has been widely used to ... | Find, read and cite all the research you need on Tech Science Press
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OpenAlex topics: Advanced Surface Polishing Techniques · Silicon and Solar Cell Technologies · Advancements in Semiconductor Devices and Circuit Design
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