Tape Automated Bonding and its Impact on the PWB
Source abstract
Abstract
This paper briefly reviews the impact that tape automated bonding systems are having in the semiconductor industry and describes a recent development of a bumped testable TAB system suitable for direct assembly to PWBs. The impact that such a system will have on PWB technology is discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · VLSI and FPGA Design Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.