High‐Strength Joints on Glass and Aluminum Alloys Through Microstructure Surfaces at Low Temperature

The high‐strength joining of glass and aluminum ensures the reliability of the components under extreme conditions. To solve the problem of poor joining strength of direct bonding between glass/aluminum alloy and metal solder, microstructure arrays are fabricated on the substrate by femtosecond laser to form mechanical interlocks to enhance the joining strength of the interface. The impact of microstructure arrays with different morphologies on the shear strength of the joints is investigated. By increasing the depth of the microstructures, it is possible to increase the strength of the glass/aluminum alloy joint up to 17.9 MPa, ≈23 times higher than direct joining of flat substrates (0.76 MPa). Meanwhile, a shear strength of up to 16.25 MPa is obtained at a low sintering temperature of 180 °C. The highest shear strength is 23.02 MPa when the sintering temperature is 200 °C, which contributes to the protection of the glass substrate against cracks caused by mismatch of the coefficient of thermal expansion. This method used to improve the strength of the glass‐aluminum alloy joint by fabricating microstructure arrays promotes the application of glass in industry.