journal article·1998-01

Industrial Processing Via Variable Frequency Microwaves Part Bonding Applications

J.B. Wei, K. Ngo, D.A. Tucker, Z. Fathi, F.L. Paulauskas, W.G. Johanson

Publisher page

Abstract

Variable frequency microwaves (VFM) offer a unique advantage in processing advanced materials, i.e. providing rapid, uniform and selective heating over a large volume at a high energy coupling efficiency. This has been demonstrated on industrial scales in various applications, including bonding of polymers or composite panels, curing of polymer or composite parts, drying of polymer films and preheating of polymer composites. This paper presents two bonding applications: I) bonding of polymer composites, including urethane-based SRIM (structure reaction injection molding) glass fiber composite panels and fiberglass reinforced polyester panels, for automotive applications, and 2) bonding (curing) off lip-chips (FC) for electronic packaging applications. Because VFM has the ability to provide a selective yet unifOrm heating of adhesives, this technology provides an attractive alternative to realize high-speed bonding for many industrial applications.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Synthesis and properties of polymers · 3D IC and TSV technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (6)

Show source-provided references
1. Fathi Z.; Tucker D.A.; Wei B.J.; Garard R.S.; Mead P.F. and Hutchins C. 1996. Rapid cure of liquid encapsulants and structural adhesives for electronics packaging using variable frequency microwave (VFM) energy. Electronic Packaging Materials Science IX Boston MA MRS vol. 445 p125–130.10.1557/PROC-445-125 ↗
2. Gilleo K. 1996. Advances in packaging & assembly polymers. Proceeding of NEPCON WEST ‘96 Anaheim CA February p775–784.
3. Hedrick J.C.; Lewis D.A.; Ward T.C. and McGrath I.E. 1988. Morphology and flextural toughness of thermoplastics modified epoxy resin networks. Poly m. Prep. Vol. 29 p363–365.
4. Paulauskas F.L.; Warren C.D. and Meek T.T. 1996a Adhesive bonding via exposure to microwave radiation and resulting mechanical evaluation. Microwave Processing of Materials V San Francisco CA. MRS Vol. 430 p193–206.10.1557/PROC-430-193 ↗
5. Paulauskas FL. McMillan A.D. and Warren C.D. 1996b. Adhesive bonding via exposure to variable frequency microwave radiation. Microwave Processing of Materials V San Francisco CA. MRS Vol. 430 p493–506.10.1557/PROC-430-493 ↗
6. Wei B.J. Hawley M.C. and DeMeuse M.T. 1995. Kinetics modeling and time-temperature-transformation diagram of microwave and thermal cure of epoxy resins. Polym. Eng. & Sci. 35(6) p461–47010.1002/pen.760350602 ↗