journal article·2005-01Open access

Optimization of MgTiO3–CaTiO3 based LTCC tapes containing B2O3 for use in microwave applications

Tao Hu, Antti Uusimäki, Heli Jantunen, Seppo Leppävuori, Kajitrat Soponmanee, Somnuk Sirisoonthorn

Ceramics International· Volume 31· Issue 1

Abstract

Optimization of MgTiO3–CaTiO3 based LTCC tapes to be used for microwave purposes was investigated. Three kinds of MgTiO3–CaTiO3 based powders containing B2O3 in different forms, and two different slurry systems (PVB and PM) were prepared for tape casting. The results clearly demonstrated that if the powder contained ‘free’ B2O3, no proper tape could be fabricated regardless of the slurry system. With other powders containing pre-reacted B2O3, dense tapes as well as multilayer strip line resonators could be fabricated. Difficulties to prepare proper tape from the powder containing ‘free’ B2O3 and different tape properties with different slurry systems are studied and discussed.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Microwave Dielectric Ceramics Synthesis · Ferroelectric and Piezoelectric Materials · Electrical and Thermal Properties of Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (19)

Show source-provided references
1. Fabrication of thin ceramic sheets for capacitors10.1111/j.1151-2916.1947.tb18889.x ↗
2. P. Barnwell, W. Zhang, J. Lebowitz, K. Jones, N. MacDonald, C. Free, Z. Tian, An investigation of the properties of LTCC materials and compatible conductors for their use in wireless applications, in: International Symposium on Microelectronics, IMAPS, 2000, pp. 659–664.
3. LTCC-MLC Duplexer for DCS-180010.1109/22.788526 ↗
4. N. McN. Alford, S.J. Penn, A. Templeton, X. Wang, J.C. Gallop, N. Klain, C. Zuccaro, P. Filhol, Microwave dielectrics, in: Proceeding of IEE Colloquium on Electro-technical Ceramics—Processing, Properties and Applications (Ref. No.: 1997/317), vol. 9, 1997, pp. 1–5.10.1049/ic:19971054 ↗
5. Passive RF band-pass filters in an LTCC module made by fine-line thick-film pastes10.1016/S0955-2219(01)00159-5 ↗
6. W.K. Jones, Y. Lie, B. Larsen, P. Wang, M. Zampino, Chemical, structural and mechanical properties of the LTCC tapes, in: Proceeding of International Symposium on Microelectronics, IMAPS, Boston, USA, 2000, pp. 669–804.
7. P.C. Donohue, B.E. Taylor, D.I. Amey, R.R. Draudt, M.A. Smith, S.J. Horowitz, J.R. Larry, A new low loss lead free LTCC system for wireless and RF applications, IEEE Digest (1998) 196–199.10.1109/ICMCM.1998.670779 ↗
8. Low-temperature sintering and microwave dielectric properties of zinc metatitanate-rutile mixtures using boron10.1111/j.1151-2916.1999.tb02200.x ↗
9. P.W. McMillan, Glass-Ceramics, Academic Press, London, 1979, pp. 184–209.
10. Effect of PVB on the gelation behaviour of BaTiO3-based dielectric particles and glass suspension10.1016/S0955-2219(03)00087-6 ↗
11. Interactions between barium strontium titanate (BST) thick films and alumina substrates10.1016/S0955-2219(01)00362-4 ↗
12. R.W. Cahn, P. Haasen, E.J. Kramer, Tape casting, in: R.J. Brook (Vol. Ed.), Materials Science Technology, vol. 17A: Processing of Ceramics, VCH Verlagsgesellschaft mbH, 1996 (Chapter 7).
13. T. Katoh, H. Ozeki, Microwave dielectric ceramic composition, US Patent 5 340 784 (23 August 1994).
14. Compositions of MgTiO3–CaTiO3 ceramic with two borosilicate glasses for LTCC technology10.1016/S0955-2219(00)00145-X ↗
15. R.E. Mistler, E.R. Twiname, Tape Casting: Theory and Practice, The American Ceramic Society, Westerville, OH, 2000, p. 240.
16. A. Dziedzic, L.J. Golonka, J. Kita, J.M. Kozowski, Macro- and microstructure of LTCC tapes and components, in: Proceedings of XXIV Conference of IMAPS, Poland, 2000, pp. 163–168.
17. Effect of solvent mixtures on dispersion of lanthanum-modified lead zirconate titanate tape casting slurries10.1111/j.1151-2916.2000.tb01449.x ↗
18. C. Berry, D. Parlow, T. Vasilow, S. Gurkovich, A. Barley, A design of experiment for a tape casting process, in: Proceedings of the International Symposium on Microelectronics, IMAPS, Boston, MA, USA, 2000, pp. 150–155.
19. Ceramic and glass packaging in the 1990s10.1111/j.1151-2916.1991.tb04320.x ↗