Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al2O3 and SiC substrates
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OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced ceramic materials synthesis
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References (13)
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1. Direct brazing of alumina ceramics10.1111/j.1551-2916.1987.tb00073.x ↗
2. Ceramic-to-metal joining with active brazing filler metal
3. Oxidation behaviour of silver- and copper-based brazing filler metals for silicon nitride/metal joints10.1111/j.1151-2916.1989.tb06151.x ↗
4. Methods for brazing ceramic and metal-ceramic joints10.1080/10426919308934826 ↗
5. Tin-based reactive solders for ceramic/metal joints10.1007/BF02670197 ↗
6. Interfacial structure of metal-ceramic joints10.2355/isijinternational.30.1033 ↗
7. Interfacial phenomena in joining of ceramics by active metal brazing alloy10.1016/0013-7944(91)90255-Y ↗
8. The role of interfacial reactions on the mechanical properties of ceramic brazements
9. The influence of brazing conditions on joint strength in Al2O3Al2O3 brazing10.1007/BF01151094 ↗
10. Characterization of ceramic/TA6V titanium alloy brazed joints10.1557/JMR.1990.0127 ↗
11. A review of oxide, silicon nitride and silicon carbide brazing
12. TURWITT, M., JANSING, T. & JUNG, J., Joining of SiC components with high temperature active brazing filler materials.
13. Heat- and oxidation resistant joints by active brazing