Microstructure and properties of partial transient liquid phase bonding joint of Si3N4 with nickel-based superalloy using ti/Au/Ni interlayers
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Intermetallics and Advanced Alloy Properties · Advanced Welding Techniques Analysis · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (41)
Show source-provided references
1. Silicon nitride for high-temperature applications10.1111/j.1551-2916.2010.03839.x ↗
2. Microstructure and mechanical properties of an Si3N4/Si3N4 joint brazed with Au-Ni-Pd-V filler alloy10.1016/j.scriptamat.2010.11.004 ↗
3. Microstructure and mechanical properties of porous Si3N4/Invar joints brazed with Ag-Cu-Ti plus Mo/Cu/Ag-Cu multi-layered composite filler10.1016/j.ceramint.2017.05.354 ↗
4. Brazing of porous Si3N4 ceramic to Invar alloy with a novel Cu–Ti filler alloy: microstructure and mechanical properties
5. Effect of brazing temperature on microstructure and mechanical properties of Si3N4/Si3N4 joints brazed with Ag–Cu–Ti + Mo composite filler10.1016/j.msea.2010.01.065 ↗
6. Inducing low-temperature melting of TiNiCuNb eutectic alloy for manufacturing strong C/C-SiC composite joints10.1016/j.matchar.2023.113562 ↗
7. Benefits of Zr additive element in the Ti-24Ni eutectic filler in vacuum brazing of SiC ceramics10.1016/j.vacuum.2019.01.034 ↗
8. Microstructural and mechanical characterization of the Si3N4/Si3N4 joint brazed using Au-Ni-V filler alloys10.1016/j.jeurceramsoc.2009.08.015 ↗
9. Low-temperature bonding of Cu on Si3N4 substrate by using Ti/Cu thin films10.1016/j.matlet.2022.132330 ↗
10. Metal to ceramic joining via a metallic interlayer bonding technique10.1016/j.jmatprotec.2003.10.005 ↗
11. Ti-Nb-Cu stress buffer layer for TiC cermet/304 stainless steel diffusion bonding10.1016/S1875-5372(16)30071-6 ↗
12. Diffusion bonding of ZrB2–SiC and Nb using dynamic compressed Ni foam interlayer10.1016/j.msea.2013.02.047 ↗
13. Interfacial microstructure and mechanical characterization of silicon nitride/nickel-base superalloy joints by partial transient liquid phase bonding10.1016/j.ceramint.2015.09.115 ↗
14. Interlayer design for partial transient liquid phase bonding of titanium and copper10.1016/j.msea.2021.140879 ↗
15. Partial transient liquid-phase metals layer technique of ceramic-metal bonding10.1007/BF00721922 ↗
16. Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer
17. High shear strength and ductile ZrC–SiC/austenitic stainless steel joints bonded with Ti/Ni foam interlayer
18. PTLPB of Si3N4 to FA-129 using nickel as a core interlayer10.1016/j.ijrmhm.2004.01.003 ↗
19. Effect of interlayer thickness on strength and fracture of Si3N4 and Inconel600 joint10.4028/www.scientific.net/KEM.297-300.2435 ↗
20. Partial transient-liquid-phase bonding of TiC cermet to stainless steel using impulse pressuring with Ti/Cu/Nb interlayer10.1007/s11771-018-3802-z ↗
21. Microstructure and mechanical properties of partial transient liquid phase bonded Si3N4–DZ483 superalloy joints10.1016/j.matlet.2014.01.072 ↗
22. An evaluation of the partial transient liquid phase bonding of Si3N4 using Au coated Ni 22Cr foils, Act
23. Moffatt · 1976 · 396
24. Ni interlayer induced strengthening effect in alumina/alumina joint bonded with Ti/Cu/Ni/Cu/Ti composite foils10.1016/j.jeurceramsoc.2023.04.059 ↗
25. First-principles investigation of structural, electronic, mechanical, and lattice dynamical properties of Ti-Au intermetallic10.1080/00150193.2021.1902762 ↗
26. Cu-Au, Ag-Au, Cu-Ag, and Ni-Au intermetallics: first-principles study of temperature-composition phase diagrams and structures10.1103/PhysRevB.57.6427 ↗
27. Influence of Ni coating on interfacial reactions and mechanical properties in laser welding-brazing of Mg/Ti butt joint10.1016/j.jallcom.2018.06.039 ↗
28. Improvement and application of new generation solution geometric model
29. Nanosecond laser-induced surface modification to strengthen Cu/Si3N4 AMB joints10.1016/j.msea.2022.143573 ↗
30. Diffusion bonding titanium to stainless steel using Nb/Cu/Ni multi-interlayer10.1016/j.matchar.2012.03.016 ↗
31. Eutectic-reaction brazing of Al0.3CoCrFeNi high-entropy alloys using Ni/Nb/Ni interlayers10.1016/j.jmst.2021.12.066 ↗
32. Interdiffusion coefficients of alloying elements in a typical Ni-based superalloy10.1016/j.vacuum.2019.108875 ↗
33. Cu + TiB2 composite filler for brazing Al2O3 and Ti–6Al–4V alloy10.1016/j.jallcom.2011.09.082 ↗
34. A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint10.1007/BF02649282 ↗
35. Balogh · 2014
36. A predictive equation for solute diffusivity in liquid metals10.1016/j.scriptamat.2006.04.019 ↗
37. Surface metallization of Cu/Ni/Au coatings on diamond/Cu composite materials for heat sink application10.1016/j.ceramint.2017.07.005 ↗
38. Brazing of porous Si3N4 ceramic to Invar alloy with a novel Cu–Ti filler alloy: microstructure and mechanical properties10.1016/j.ceramint.2020.09.039 ↗
39. Interdiffusion in Au(120 nm)/Ni(70 nm) thin films at the low-temperature annealing in the different atmospheres10.1016/j.vacuum.2012.07.005 ↗
40. Calculation of diffusion coefficient of liquid less simple metals10.1016/j.physb.2022.414482 ↗
41. Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding