Geometrical positioning surveying-based features for BEOL line-end-pull-back modeling using regression-based machine-learning
Source abstract
Abstract
BackgroundLine-end-pull-back (LEPB) is a well-known systematic defect in BEOL metal layers, where a line-end (LE) tip is pulled back from its desired location due to lithography (litho) process effects. Severe LEPB directly affects BEOL connectivity and may lead to partial or total metal-via disconnection.AimLEPB can be characterized through model-based litho simulations but at the cost of high computational resource consumption. This study aims to provide a fast and accurate approximation of computationally expensive litho simulations through regression-based machine learning (ML) modeling.ApproachLEPB modeling is approached through the LightGBM model. Input features were approached using density pixels, density concentric circle area sampling (CCAS), and geometrical positioning surveying (GPS), which is an edge-based engine that provides a direct one-to-one mapping between model features and geometrical measurements between the LE as a point-of-interest and its surrounding contextual patterns. The importance of LightGBM features by splits was employed to reduce features across the used approaches.ResultsThe reduced features of GPS produced almost the same modeling quality (training: RMS = 0.571 nm, δEWD = 0.297 nm, and R2 % = 98.74 % , and testing: RMS = 0.643 nm, δEWD = 0.344 nm, and R2 % = 98.40 % ) with −22.22 % fewer number of features and less feature extraction runtime compared to the full features set of density pixels and density CCAS approaches.ConclusionsCompared to model-based litho simulations, the obtained calibrated ML models can be used to provide fast, yet accurate predictions of the amounts of pull-back or extensions introduced at LEs near vias, eliminating a major contributor to systematic IC yield loss.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advancements in Photolithography Techniques · Integrated Circuits and Semiconductor Failure Analysis · Industrial Vision Systems and Defect Detection
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Ain Shams University, Electronics Engineering and Electrical Communications Department, Faculty of Engineering, Cairo, Egypt
Siemens EDA, Calibre Design-to-Silicon, Siemens Industry Software Inc., Cairo, Egypt
Ain Shams University, Computer and Systems Engineering Department, Faculty of Engineering, Cairo, Egypt
References
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