Effect of annealing treatment of Si3N4 ceramics on the joining of Si3N4 ceramic and oxygen-free copper
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OpenAlex topics: Advanced ceramic materials synthesis · Advanced materials and composites · Aluminum Alloys Composites Properties
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References (56)
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1. A tough silicon nitride ceramic with high thermal conductivity10.1002/adma.201102462 ↗
2. Improved thermal conductivity of β-Si3N4 ceramics through the modification of the liquid phase by using GdH2 as a sintering additive10.1016/j.ceramint.2020.10.148 ↗
3. Cost effective preparation of Si3N4 ceramics with improved thermal conductivity and mechanical properties10.1016/j.jeurceramsoc.2019.10.003 ↗
4. Improved thermal conductivity of β-Si3N4 ceramics by lowering SiO2/Y2O3 ratio using YH2 as sintering additive10.1111/jace.17271 ↗
5. Thermal-cycling-induced surface roughening and structural change of a metal layer bonded to silicon nitride by active metal brazing10.1007/s10854-017-7031-2 ↗
6. Metal ceramic substrates for highly reliable power modules - not only in electric vehicles10.1007/s42411-020-0086-8 ↗
7. Cyclic thermal stress-induced degradation of Cu metallization on Si3N4 substrate at −40°C to 300°C10.1007/s11664-014-3357-1 ↗
8. Effects of yttria and magnesia on densification and thermal conductivity of sintered reaction‐bonded silicon nitrides10.1111/jace.16015 ↗
9. Microstructure evolution of Si3N4 ceramics with high thermal conductivity by using Y2O3 and MgSiN2 as sintering additives10.1016/j.ceramint.2023.05.160 ↗
10. Effect of mechanical properties of the ceramic substrate on the thermal fatigue of Cu metallized ceramic substrates
11. Effect of high temperature cycling on both crack formation in ceramics and delamination of copper layers in silicon nitride active metal brazing substrates10.1016/j.ceramint.2017.01.020 ↗
12. Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity10.1016/j.ceramint.2018.02.072 ↗
13. Residual stress induced failure of Ti-6Al-4V/Si3N4 joints brazed with Ag-Cu-Ti filler: the effects of brazing zone's elasto-plasticity and ceramics' intrinsic properties10.1016/j.jeurceramsoc.2021.06.038 ↗
14. Low temperature pressureless sintering of silicon nitride ceramics for circuit substrates in powder electronic devices10.1016/j.ceramint.2017.12.033 ↗
15. High thermal conductivity silicon nitride ceramics prepared by pressureless sintering with ternary sintering additives10.1111/ijac.13220 ↗
16. Research advances in residual thermal stress of ceramic/metal brazes10.1016/j.ceramint.2021.04.220 ↗
17. Direct joining of 2D carbon/carbon composites to Ti–6Al–4V alloy with a rectangular wave interface10.1016/j.msea.2007.11.013 ↗
18. On the shear strength of laser brazed SiC–steel joints: effects of braze metal fillers and surface patterning10.1016/j.ceramint.2009.12.010 ↗
19. A novel approach to brazing C/C composite to Ni-based superalloy using alumina interlayer10.1016/j.jeurceramsoc.2011.12.016 ↗
20. Interfacial reactions and zigzag groove strengthening of C/C composite and Rene N5 single crystal brazed joint10.1016/j.ceramint.2015.05.119 ↗
21. Vacuum brazing of alumina to stainless steel using femtosecond laser patterned periodic surface structure10.1016/j.msea.2016.03.068 ↗
22. Thermal stability of electroconductive TiN-reinforced silicon oxynitride composites10.1016/0955-2219(94)90058-2 ↗
23. Properties of Si3N4–TiN composites fabricated by spark plasma sintering by using a mixture of Si3N4 and Ti powders10.1016/j.ceramint.2009.09.029 ↗
24. Si3N4/TiN composites produced from TiO2-Modified Si3N4 powders10.1134/S0020168512090087 ↗
25. Densification, microstructure and properties of Si3N4-Ti(C,N) composites10.1016/0955-2219(93)90104-Y ↗
26. TiO2 additives for in situ formation of toughened silicon nitride-based composites10.1016/S0167-577X(03)00282-9 ↗
27. Thermal conductivity of β-Si3N4: II, effect of lattice oxygen10.1111/j.1151-2916.2000.tb01501.x ↗
28. Densification, microstructure, thermal and mechanical properties of Si3N4 ceramics: effect of Y2Si4N6C and MgSiN2 content10.1016/j.ceramint.2024.07.215 ↗
29. Effect of cooling rate after hot pressing on electrical conductivity of Si3N4-ceramics with TiO2 and TiH2 additives10.2298/PAC1002063C ↗
30. Enhanced thermal conductivity in Si3N4 ceramics prepared by using ZrH2 as an oxygen getter10.1016/j.jallcom.2020.157451 ↗
31. Decomposition of TiH2 studied in situ by synchrotron X-ray and neutron diffraction10.1016/j.actamat.2011.06.042 ↗
32. Effect of TiX(X=C, N, O) additives on microstructure and properties of silicon nitride based ceramics10.1016/j.scriptamat.2005.05.024 ↗
33. Effects of Ti(C,N) nanoparticles on mechanical properties of the Si3N4 ceramics10.4028/www.scientific.net/AMM.80-81.119 ↗
34. Formation of tough interlocking microstructures in silicon nitride ceramics by dynamic ripening10.1038/417266a ↗
35. Silicon nitride and related materials10.1111/j.1151-2916.2000.tb01182.x ↗
36. Thermal conductivity of ß‐Si3N4: I, effects of various microstructural factors10.1111/j.1151-2916.1999.tb02209.x ↗
37. Strength and microstructure of diffusion bonded titanium using silver and copper interlayers10.1016/j.msea.2010.04.065 ↗
38. Characterization of transient liquid-phase bonded joints in a copper-beryllium alloy with silver-base interlayer10.1007/s11665-011-9953-9 ↗
39. Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prepared by diffusion bonding10.1016/j.msea.2013.12.017 ↗
40. Fabrication of copper/stainless steel bimetallic couple, by diffusion bonding using silver and nickel foils as interlayers10.1080/24701556.2019.1597885 ↗
41. Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu‐metalized AlN substrate10.1111/jace.18092 ↗
42. Interfacial characterization of silicon nitride/silicon nitride joints brazed using Cu-base active metal interlayers10.1016/j.ceramint.2011.11.050 ↗
43. Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag–Cu–Ti+SiCp composite filler10.1016/j.ceramint.2010.02.010 ↗
44. Nanostructure of wetting triple line in a Ag–Cu–Ti/Si3N4 reactive system10.1016/S1359-6454(98)00375-9 ↗
45. Effect of interfacial microstructure evolution on the peeling strength and fracture of silicon nitride/oxygen-free copper foil joints brazed with Ag-Cu-TiH2 filler10.1016/j.jeurceramsoc.2023.03.038 ↗
46. Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler10.1111/jace.19921 ↗
47. The influence of Ti: Si3N4 ratio on the microstructure evolution of Ti–Si3N4 reaction in Cu melts10.1016/j.ceramint.2022.05.252 ↗
48. In situ synthesis of Ti5Si3 matrix nanocomposites reinforced with nanoparticles by high-energy mechanical alloying10.1002/adem.201000377 ↗
49. Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy10.1007/s40145-019-0330-8 ↗
50. The microstructures of the TiN–Ti5Si3 hybrid reinforced Cu matrix composites fabricated by the Ti–Si3N4 reaction and its preparation mechanism10.1016/j.jmrt.2021.07.089 ↗
51. Growth mechanism of primary Ti5Si3 phases in special brasses and their effect on wear resistance10.1016/j.jmst.2020.05.063 ↗
52. Oxynitride glasses10.1111/j.1744-7402.2008.02205.x ↗
53. Grain boundary glasses in silicon nitride: a review of chemistry, properties and crystallisation10.1016/j.jeurceramsoc.2011.12.023 ↗
54. Strain energy distribution in ceramic-to-metal joints10.1016/S1359-6454(01)00352-4 ↗
55. Properties and fractography of Si3N4/TiN ceramic joined to steel with active single layer and double layer braze filler alloys10.1016/j.actamat.2004.06.016 ↗
56. Microstructure and mechanical properties of the Si3N4/42CrMo steel joints brazed with Ag-Cu-Ti plus Mo composite filler10.1016/j.jeurceramsoc.2010.07.005 ↗