Thermal fatigue failure mechanism in the joint of nano Cu/Ti–Si3N4 ceramic substrates after thermal fatigue test
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Advanced ceramic materials synthesis · Aluminum Alloys Composites Properties · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (40)
Show source-provided references
1. Effects of extreme temperature swings (−55 °Cto 250 °C) on silicon nitride active metal brazing substrates10.1109/TDMR.2014.2320057 ↗
2. Residual stress and warpage of AMB ceramic substrate studied by finite element simulations10.1016/j.microrel.2019.04.025 ↗
3. Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling10.1016/j.microrel.2006.07.057 ↗
4. Thermal fatigue crack growth behavior of Ni60 coating and bonding area on 20CrNiMo alloy strengthened by laser shock processing10.1016/j.jallcom.2022.168305 ↗
5. Thermal fatigue damage and residual mechanical properties of W-Cu/Ag-Cu/1Cr18Ni9 brazed joint10.1016/j.jallcom.2018.01.151 ↗
6. Interfacial microstructure and mechanical properties of diffusion-bonded W–10Cu composite/AlN ceramic using Ni–P and Ti interlayers10.1016/j.jallcom.2021.159050 ↗
7. Mechanical performances of AlN/Al metallized ceramic substrates fabricated by transient liquid phase bonding and pre-oxidation treatment10.1016/j.ceramint.2022.02.206 ↗
8. Interfacial microstructure and mechanical properties of diffusion-bonded W–10Cu composite/AlN ceramic using Ni–P and Ti interlayers10.1016/j.jallcom.2021.159050 ↗
9. The influence of Ti interlayer on the microstructure evolution and mechanical properties of CuW/Al composite10.1016/j.vacuum.2023.112207 ↗
10. Interfacial microstructure and mechanical properties of joints between ZrO2 ceramic and 316 stainless steel brazed using Ag–Cu–In–Ti filler10.1016/j.vacuum.2023.112668 ↗
11. Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability10.1016/j.microrel.2015.08.010 ↗
12. Fabrication and properties of symmetrical W/Si3N4/W functionally graded materials by spark plasma sintering10.1016/j.jallcom.2021.163077 ↗
13. Nanosecond laser-induced surface modification to strengthen Cu/Si3N4 AMB joints
14. Low-temperature bonding of Cu on Si3N4 substrate by using Ti/Cu thin films10.1016/j.matlet.2022.132330 ↗
15. Fabrication of Si3N4/Cu direct-bonded heterogeneous interface assisted by laser irradiation10.1016/j.jmst.2021.05.032 ↗
16. Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity10.1016/j.ceramint.2018.02.072 ↗
17. An optimal structural design to improve the reliability of Al2O3–DBC substrates under thermal cycling10.1016/j.microrel.2015.11.013 ↗
18. Strengthening materials by engineering coherent internal boundaries at the nanoscale10.1126/science.1159610 ↗
19. Revealing the maximum strength in nano twinned copper10.1126/science.1167641 ↗
20. Cyclic thermal stress-induced degradation of Cu metallization on Si3N4 substrate at−40 °C to 300 °C10.1007/s11664-014-3357-1 ↗
21. Strain energy distribution in ceramic-to-metal joints10.1016/S1359-6454(01)00352-4 ↗
22. Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution10.1016/j.ijfatigue.2022.107356 ↗
23. Effect of repeated thermal cycles on thermal stress in copper paste films on alumina substrates10.1007/s10854-016-4858-x ↗
24. Effects of microfluidic morphologies on the interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and pure copper brazed joints10.1016/j.ceramint.2023.01.239 ↗
25. Effect of high temperature cycling on both crack formation in ceramics and delamination of copper layers in silicon nitride active metal brazing substrates10.1016/j.ceramint.2017.01.020 ↗
26. Crack initiation and propagation mechanism of Al2O3-DBC substrate during thermal cycling test10.1016/j.engfailanal.2020.104720 ↗
27. Enhanced thermal stability of nanograined metals below a critical grain size10.1126/science.aar6941 ↗
28. Gradient plasticity in gradient nanocrystalline metals: extra toughness from dislocation migration10.1016/j.mechmat.2021.103879 ↗
29. Polysynthetic twinned TiAl single crystals for high-temperature applications10.1038/nmat4677 ↗
30. A novel nano Cu/Ti–Si3N4 ceramic substrates fabricated by spark plasma sintering and its bonding mechanism10.1016/j.vacuum.2021.110093 ↗
31. Fabrication and joining mechanism of Nano-Cu/Si3N4 ceramic substrates10.1016/j.ceramint.2020.09.186 ↗
32. Jeurgens, in situ oxidation studies of Cu thin films: growth kinetics and oxide phase evolution
33. In situ TEM study of grain growth in nanocrystalline copper thin films
34. Stress-assisted grain growth in nanocrystalline metals: grain boundary mediated mechanisms and stabilization through alloying10.1016/j.actamat.2017.03.060 ↗
35. Effect of biaxial strain on grain growth in nanocrystalline films: coupling between grain-boundary energy and strain energy10.1016/j.actamat.2022.118633 ↗
36. Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil10.1007/s10854-021-06135-7 ↗
37. Thermodynamics of CuAlO2 and CuAl2O4 and phase equilibria in the system Cu2O-CuO-Al2O310.1111/j.1151-2916.1975.tb11441.x ↗
38. Microstructural evolution and characterisation of interfacial phases in Al2O3/Ag–Cu–Ti/Al2O3 braze joints10.1016/j.actamat.2015.05.048 ↗
39. Thermal ratchetting effect of AMB-AlN ceramic substrate: experiments and calculations10.1016/j.ceramint.2019.04.186 ↗
40. Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging10.1016/j.jallcom.2011.08.044 ↗