Investigation of thin film end-termination on multilayer ceramic capacitors with base-metal-electrode
Source abstract
Abstract
Abstract The thin film of copper, chromium and titanium as end-termination studies were performed on multilayer ceramic capacitors (MLCCs) based on BaTiO3 ceramic with nickel internal electrodes. A green sheet was prepared by tape casting using the X7R/BME powders. Nickel paste was attached to the green sheet as an internal electrode. After lamination, the green chips were sintered at 1300 °C for 2 h, then the external electrodes were sputtered as thin films for end-termination. There is no extra curing process, so that thermal shock of the MLCCs is reduced. To improve the adhesion between thin film end-termination and dielectric body, chromium and titanium were applied as media in this study. The mechanical and electrical properties of the MLCCs were investigated subsequently. The results showed that end-termination with chromium/copper has good performances on electrical and mechanical properties of MLCC, compared to conventional end-termination.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Ferroelectric and Piezoelectric Materials · Semiconductor materials and devices · Dielectric materials and actuators
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (13)
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1. Interfacial reaction of Ag/Pd metals with Pb-based relaxor ferroelectrics including additives10.1016/S0272-8842(00)00046-8 ↗
2. Relationships between interfacial interaction, electrode formulation and cofiring mismatch of relaxor-based multilayer ceramic devices
3. Interfacial development and microstructural imperfection of multilayer ceramic chips with Ag/Pd electrodes10.1016/S0272-8842(01)00047-5 ↗
4. Encapsulation of Ag films on SiO2 by Ti reactions using Ag–Ti alloy/bilayer structures and an NH3 ambient10.1063/1.116564 ↗
5. Wolter · J. Appl. Phys. · 1965 · 36 · 237710.1063/1.1714494 ↗
6. Shacham-Diamand · J. Electrochem. Soc. · 1993 · 140 · 242710.1149/1.2220837 ↗
7. Itow · Appl. Phys. Lett. · 1993 · 63 · 93410.1063/1.109849 ↗
8. Nanocrystlline and nanocomposite CrCu and CrCu–N films prepared by magnetron sputtering10.1016/S0257-8972(99)00065-1 ↗
9. A study of ceramic addition in end termination of multilayer ceramics capacitors with cofiring process10.1016/j.matchemphys.2006.01.020 ↗
10. Processing–structure–adhesion relationship in CVD diamond films on titanium substrates10.1016/S0925-9635(98)00251-9 ↗
11. A simple technique for measuring the adhesion of brittle films to ductile substrates with application to diamond-coated titanium10.1557/JMR.1997.0260 ↗
12. A enhanced adhesion of copper to dielectric via titanium and chromium additions and sacrificial reaction10.1016/0040-6090(94)05812-1 ↗
13. The effect of silver polymer termination on the equivalent series resistance of high voltage ceramic capacitors