Regulation of silicon bottom corner flatness through multi-parameter collaborative optimization in deep reactive ion etching

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Research context

OpenAlex topics: Plasma Diagnostics and Applications · Advancements in Semiconductor Devices and Circuit Design · Silicon and Solar Cell Technologies

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Affiliations

North University of China, State Key Laboratory of Extreme Environment Optoelectronic Dynamic Measurement Technology and Instrument, Taiyuan, China

Shenyang Academy of Instrumentation Science Co., Ltd., Shenyang, China

Beijing NAURA Microelectronics Equipment Co., Ltd., Beijing, China

Funding

National Key Research and Development Program of China

References

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