Interfacial characterization of silicon nitride/silicon nitride joints brazed using Cu-base active metal interlayers

Abstract Silicon nitride/silicon nitride joints were vacuum brazed at 1317 K for 5 min and 30 min using ductile Cu-base active metal interlayers. The joints were characterized using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), electron back scattered diffraction (EBSD), and transmission electron microscopy (TEM). An inhomogeneous Ti-rich reaction layer (∼2–3 μm thick) formed in 5 min at the Si3N4/braze interface. The inhomogeneity disappeared after brazing for 30 min and was replaced with a compact and featureless reaction zone. TEM studies revealed fine grains in the reaction layer, and larger grains in the inner part of the joint interfaces. The joints were crack-free and presented features associated with plastic deformation, which indicated accommodation of strain associated with CTE mismatch. Electron Backscatter diffraction (EBSD) revealed a highly textured braze alloy interlayer and its crystallographic orientation was determined. The formation of additional phases at the joint interface during brazing is discussed.