Stereolithographic additive manufacturing diamond/SiC composites with high thermal conductivity for electronic 3D-packaging applications
Source abstract
Abstract
Abstract Diamond/SiC composites with high thermal conductivity are important materials for electronic industry, especially electronic packaging, but their complex structures and high-precision manufacturing are still challenging issues. Stereolithography-based manufacturing method combined with the reactive melt infiltration to make diamond/SiC composites with high-precision complex structures has been proposed in this paper. Diamond particles were used as the raw material, and as the particle size is a key factor affecting composite performance its influence was studied by means of measuring parameters, examining microstructure, and detecting components, whereas related mechanisms are discussed as necessary. Subsequently, a diamond/SiC composite with the thermal conductivity of 245.68 W/(m K) has been prepared and used in experiment. The experiment shows that the precision is affected by light-scattering and bending in the printing plane and in the vertical plane respectively, with the size errors of 0.25 and 0.12 mm.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Additive Manufacturing and 3D Printing Technologies · Diamond and Carbon-based Materials Research · Injection Molding Process and Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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