Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag–Cu–Ti+SiCp composite filler
Source abstract
Abstract
Abstract The Si 3 N 4 ceramic was brazed by Ag–Cu–Ti + SiCp composite filler (p = particle) prepared by mechanical mixing. Effects of the content of Ti and SiC particles on microstructure of the joint were investigated. A reliable Si 3 N 4 /Si 3 N 4 joint was achieved by using Ag–Cu–Ti + SiCp composite filler at 1173 K for 10 min. A continuous and compact reaction layer, with a suitable thickness, forms at the Si 3 N 4 /braze interface. The SiC particles react with Ti in the brazing layers, forming Ti 3 SiC 2 thin layers around the SiC particles themselves and Ti 5 Si 3 small particles in the Ag[Cu] and Cu[Ag] based solid solution. The higher content of SiC particles in the filler (≥10 vol%) depresses interfacial bonding strength between the Si 3 N 4 substrate and composite brazing layer due to the thinner reaction layer and the bad fluidity of the filler. The Ti 3 SiC 2 → TiC + Ti 5 Si 3 reaction occurs when Ti concentration around SiC particles in the filler increases.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced ceramic materials synthesis · MXene and MAX Phase Materials · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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