Microstructure evolution of SiC/SiC joints during ultrasonic-assisted air bonding using a Sn–Zn–Al alloy

Abstract Direct soldering of SiC ceramic in air at 230 °C was achieved using a Sn–9Zn–2Al alloy assisted by ultrasonic wave within seconds. Experimental results indicated that a sound metallurgical bond was formed between the SiC ceramic and Sn–9Zn–2Al alloys. The dependence of interfacial microstructure evolution on ultrasonic action duration time was investigated. Two types of interfacial structures at the interface were observed as the ultrasonic action duration time increased. An amorphous SiO2 layer was identified at the interface for ultrasonic exposures of 1 s, which was the oxide layer formed on the SiC ceramic surface during heating. A layer of amorphous alumina with a thickness of ~ 6.8 nm formed at the interface under ultrasonic action for over 4 s. The shear strength of joints could reach up to 44 MPa. The formation of the alumina layer at the interface was attributed to the redox reaction of Al from the filler metal and SiO2 on the SiC ceramic surface under the action of ultrasonic waves. The rapid interfacial reaction was principally induced by the acoustic cavitation and streaming effects at the liquid/solid interface.