Fabrication and properties of thermal insulating material using hollow glass microspheres bonded by aluminum–chrome–phosphate and tetraethyl orthosilicate

Abstract Thermal insulation material made by hollow glass microspheres (HGM) with different content of aluminum–chrome–phosphate solution (ACP) and tetraethyl orthosilicate (TEOS) as binders was formed, dried and sintered at 250 °C, 450 °C or 650 °C for 2 h. Properties such as density, compressive strength, thermal conductivity and microstructure of the specimens were determined. It is found that TEOS improved the distribution of ACP and increased the compressive strength of the specimens. HGM bonded by appropriate amount of ACP and TEOS achieved preferable value of density, compressive strength and thermal conductivity which were significant for thermal insulation materials. The compressive strength of specimens sintered at 450 °C and 650 °C was higher than that of the specimens sintered at 250 °C.