journal article·2016-07

Fabrication and characterization of in-situ duplex plasma-treated nanocrystalline Ti/AlTiN coatings

Chaolin Tan, Tongchun Kuang, Kesong Zhou, Hongmei Zhu, Yang Deng, Xueping Li, Panpan Cai, Zongwen Liu

Ceramics International· Volume 42· Issue 9
Publisher page

Abstract

Abstract Plasma nitriding and plasma-assisted PVD duplex treatment was adopted to improve the load-bearing capacity, fatigue resistance and adhesion of the AlTiN coating. Ion etch-cleaning was applied for better adhesion before plasma nitriding. After plasma nitriding Ti interlayer was in-situ deposited by high power impulse magnetron sputtering (HIPIMS), followed by the AlTiN coating through in-situ deposition by advanced plasma-assisted arc (APA-Arc). The microstructure and properties of the duplex-treated coating were carefully characterized and analyzed. The results show that the thicknesses of the nitriding zone, the γ′-Fe 4 N compound layer, the Ti interlayer and the AlTiN top layer with nanocrystalline microstructures are about 60 μm, 2–3 μm, 100 nm and 6.1 μm, respectively. The nitriding rate is about 30 μm/h and the AlTiN coating deposition rate reaches 6.1 μm/h. The interfacial adhesion of the Ti/AlTiN coating is well enhanced by ion etch-cleaning and a Ti interlayer, and the load-bearing capacity is also improved by duplex treatment. In addition, the instinct hardness of the Ti/AlTiN coating reaches 3368HV 0.05 while the wear rate coefficient of 5.394×10 −8 mm −3 /Nm is sufficiently low. The Ti/AlTiN coating, which possesses a high corrosion potential ( E corr =−104.6 mV) and a low corrosion current density ( i corr =4.769 μA/cm 2 ), shows highly protective efficiency to the substrate.
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Research context

OpenAlex topics: Metal and Thin Film Mechanics · Diamond and Carbon-based Materials Research · GaN-based semiconductor devices and materials

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