Thermal conductivity enhancement of alumina/polyamide composites via interfacial modification
Source abstract
Abstract
Abstract Ceramic/polymer composite materials with higher thermal conductivity are required in industries, as they will improve product reliability, functionality and manufacturing cost. An important question concerning the thermally conductive composites is how to alleviate the negative effects of interfacial thermal resistance. A novel preparation method of thermally conductive composites is described in this paper. The process can be characterized by creating an organic substance layer with ordered structure between crystalline fillers and polymer matrices. The unique framework should result in decreased scattering for phonon transfer, and the thermal conductivity of the prepared composites exhibits a significant improvement without increasing solids loading. The methodology reported herein is promising for practical thermal management using composites with lower solids loading.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Thermal properties of materials · Composite Material Mechanics · Thermal Expansion and Ionic Conductivity
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (25)
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