Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder
Source abstract
Abstract
Abstract Sn-0.7Cu is among the least expensive types of lead-free solders available. However, its poor mechanical properties have limited its application. In this study, Sn-Cu lead-free solder reinforced with amorphous silica (SiO2) nanoparticles was synthesized through powder metallurgy route. Desired mixtures of raw materials was mechanically milled, compressed, sintered and extruded to prepare bulk solder samples. The samples were characterized by optical and electron microscopy as well as mechanical tests. The results showed that mechanical properties were increased by addition of SiO2 nanoparticles to the solder matrix. Addition of 1.5 wt% ceramic reinforcement to the composite increased tensile, yield and compressive strengths up to 27%, 23% and 41%, respectively, compared to those of the monolithic sample. In addition, the ceramic nanoparticles caused an up to 50% decrease in the wetting angle between the substrate and the nanocomposite solder.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Advanced ceramic materials synthesis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (35)
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