Laser-excited surface acoustic wave method for detecting subsurface damage of processed silicon nitride ceramics
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OpenAlex topics: Advanced Surface Polishing Techniques · Ultrasonics and Acoustic Wave Propagation · Laser Material Processing Techniques
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References (52)
Show source-provided references
1. Wear maps of HIP sintered Si3N4/MLG nanocomposites for unlike paired tribosystems under ball-on-disc dry sliding conditions10.1016/j.jeurceramsoc.2017.05.005 ↗
2. Review of recent progress on silicon nitride-based photonic integrated circuits10.1109/ACCESS.2020.3032186 ↗
3. Cutting performance and tool wear of SiAlON and TiC-whisker-reinforced Si3N4 ceramic tools in side milling Inconel 71810.1016/j.ceramint.2021.10.084 ↗
4. Thermal characteristics of a 90-mm bore cylindrical roller bearings for aerospace applications: all-steel versus hybrid bearings10.1016/j.triboint.2023.108495 ↗
5. Silicon nitride: the engineering material of the future10.1007/s10853-011-5942-5 ↗
6. Silicon nitride laser cladding: a feasible technique to improve the biological response of zirconia10.1016/j.matdes.2020.108649 ↗
7. Effect of composite sintering additives containing non-oxide on mechanical, thermal and dielectric properties of silicon nitride ceramics substrate10.1016/j.ceramint.2021.01.224 ↗
8. Methods for detection of subsurface damage: a review10.1186/s10033-018-0229-2 ↗
9. Grinding induced damage in ceramics10.1016/S0924-0136(02)00952-4 ↗
10. Experimental research on surface characteristics and subsurface damage behavior of monocrystal sapphire induced by helical micro abrasive tools10.1016/j.ceramint.2022.04.114 ↗
11. Effects of grinding parameters on surface quality in silicon nitride grinding10.1016/j.ceramint.2016.10.135 ↗
12. Subsurface damage analysis by TEM and 3D FIB crack mapping in alumina and alumina/5vol.%SiC nanocomposites10.1016/S1359-6454(02)00387-7 ↗
13. High-spatial-resolution sub-surface imaging using a laser-based acoustic microscopy technique10.1109/TUFFC.2011.1789 ↗
14. Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering10.1016/j.jmatprotec.2020.116746 ↗
15. Feasibility of polarized laser scattering in detecting the grinding-induced subsurface damage in SiCf/SiC ceramic matrix composite10.1016/j.compstruct.2022.115660 ↗
16. Subsurface evaluation of ground ceramics10.1016/S0007-8506(07)62322-1 ↗
17. Predicting subsurface damage in silicon nitride ceramics subjected to rotary ultrasonic assisted face grinding10.1016/j.ceramint.2019.02.055 ↗
18. Hed · 1988
19. Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon10.1016/j.matdes.2017.05.068 ↗
20. Determination of elastic modulus and thickness of surface layers by ultrasonic surface waves10.1016/0040-6090(92)90728-T ↗
21. Density and elastic constants of hot-filament-deposited polycrystalline diamond films: methane concentration dependence10.1016/S0040-6090(97)00582-8 ↗
22. Young's modulus of silicon nitride used in scanning force microscope cantilevers10.1063/1.1638886 ↗
23. Laser-based measurement of elastic and mechanical properties of layered polycrystalline silicon structures with projection masks10.1063/1.2181187 ↗
24. Multimode photoacoustic method for the evaluation of mechanical properties of heteroepitaxial diamond layers10.1063/1.3493245 ↗
25. The mechanical properties of various chemical vapor deposition diamond structures compared to the ideal single crystal10.1063/1.3683544 ↗
26. Evaluating surface hardened steels by laser-acoustics10.1016/j.surfcoat.2011.09.017 ↗
27. Model based laser-ultrasound determination of hardness gradients of gas-carburized steel10.1016/j.ndteint.2017.02.006 ↗
28. Hadamovsky · 1985
29. Rotational grinding of silicon wafers—sub-surface damage inspection10.1016/j.mseb.2003.12.008 ↗
30. Nondestructive characterization of sub-surface damage in rotational ground silicon wafers by laser acoustics10.1016/j.mee.2006.11.001 ↗
31. Inversion of surface damage and residual stress in ground silicon wafers by laser surface acoustic wave technology10.1016/j.ultras.2021.106367 ↗
32. Quantifying the subsurface damage and residual stress in ground silicon wafer using laser ultrasonic technology: a Bayesian approach10.1016/j.ymssp.2022.109008 ↗
33. Defects detection on silicon nitride balls by laser ultrasonics10.1063/1.1916693 ↗
34. Non-destructive testing of ceramic balls using high frequency ultrasonic resonance spectroscopy10.1016/j.ultras.2005.06.003 ↗
35. Surface wave acoustic microscopy for rapid non-destructive evaluation of silicon nitride balls10.1007/s10921-011-0115-7 ↗
36. Stable recursive algorithm for elastic wave propagation in layered anisotropic media: stiffness matrix method10.1121/1.1497365 ↗
37. Uncertainty estimation in seismo-acoustic reflection travel time inversion10.1121/1.2736514 ↗
38. Bayesian geoacoustic inversion of single hydrophone light bulb data using warping dispersion analysis10.1121/1.4809678 ↗
39. Freund · 1988
40. The Kolmogorov-smirnov test for goodness of fit10.1080/01621459.1951.10500769 ↗
41. Ensemble samplers with affine invariance10.2140/camcos.2010.5.65 ↗
42. Emcee: the MCMC hammer, publ. Astron
43. Imaging dispersion curves of surface waves on multi‐channel record
44. Offset and resolution of dispersion curve in multichannel analysis of surface waves (MASW)
45. Shackelford · 2000
46. Residual stress and damage effect on integrity of ground silicon nitride10.1023/A:1004711731027 ↗
47. Surface acoustic wave depth profiling of a functionally graded material10.1063/1.2774002 ↗
48. Multimode photoacoustic characterization of subsurface damage in ground thin wafers10.1016/j.ijmecsci.2022.107845 ↗
49. Formulas for the Rayleigh wave speed in orthotropic elastic solids
50. Evaluation of surface and sub-surface cracks of ground ceramic10.1016/S0924-0136(98)00403-8 ↗
51. Optimization of grinding process parameters of silicon nitride ceramic based on response surface method
52. Indentation size effect: reality or artefact?10.1007/BF00360764 ↗