journal article·2024-12

Synergetic effect of diamond particle size on thermal expansion of Cu-B/diamond composite

Jinpeng Hao, Yongjian Zhang, Xiangyu Zhu, Ning Li, Jingjie Dai, Xitao Wang, Moon J. Kim, Hailong Zhang

Ceramics International· Volume 50· Issue 24
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Abstract

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OpenAlex topics: Aluminum Alloys Composites Properties · Advanced materials and composites · Advanced ceramic materials synthesis

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References (50)

Show source-provided references
1. Efficient modulation of thermal transport in two-dimensional materials for thermal management in device applications10.1039/D2NR06413H ↗
2. Thermoelectric coolers for on-chip thermal management: materials, design, and optimization10.1016/j.mser.2022.100700 ↗
3. A review of processing of Cu/C base plate composites for interfacial control and improved properties10.1088/2631-7990/ab61c5 ↗
4. Microstructure and thermal properties of copper matrix composites reinforced by 3D carbon fiber networks
5. On the role of amorphous intergranular and interfacial layers in the thermal conductivity of a multi-walled carbon nanotube–copper matrix composite10.1016/j.actamat.2011.09.056 ↗
6. Effect of graphite flakes particle sizes on the microstructure and properties of graphite flakes/copper composites10.1016/j.jallcom.2018.06.129 ↗
7. Synergetic effect enabling high thermal conductivity in Cu/diamond composite10.1016/j.diamond.2023.110213 ↗
8. Interphase layer characteristics and thermal conductivity of hot-forged Cu-B/diamond composites10.1007/s42114-021-00248-7 ↗
9. High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite10.1016/j.carbon.2020.07.001 ↗
10. Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation10.1016/j.cej.2023.146666 ↗
11. Effect of titanium addition on the thermal properties of diamond/Cu-Ti composites fabricated by pressureless liquid-phase sintering technique
12. Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration10.1016/j.jallcom.2019.04.252 ↗
13. Preparation of copper–diamond composites with chromium carbide coatings on diamond particles for heat sink applications10.1016/j.applthermaleng.2013.05.038 ↗
14. Effect of molybdenum carbide intermediate layers on thermal properties of copper–diamond composites10.1016/j.jallcom.2013.04.121 ↗
15. Improved thermal performance of diamond-copper composites with boron carbide coating10.1007/s11665-013-0780-z ↗
16. Influence of interfacial carbide layer characteristics on thermal properties of copper–diamond composites10.1007/s10853-012-6878-0 ↗
17. Size dependent strengthening mechanisms in carbon nanotube reinforced metal matrix composites10.1016/j.compositesa.2014.10.018 ↗
18. Initial dislocation distributions in tungsten fibre-copper composites10.1007/BF00549547 ↗
19. Atomistic simulation on the generation of defects in Cu/SiC composites during cooling10.1016/j.jmst.2021.10.058 ↗
20. Effects of particle size on the thermal expansion behavior of SiCp/Al composites10.1007/s10853-006-1200-7 ↗
21. High-temperature thermal conductivity and thermal cycling behavior of Cu–B/diamond composites10.1109/TCPMT.2019.2958056 ↗
22. 2005
23. Structural characterisation of B4C films deposited by laser-assisted CVD10.1016/0257-8972(95)02602-9 ↗
24. Thermal stability of dopants in boron carbide10.1016/j.scriptamat.2021.114263 ↗
25. Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix10.1016/j.matchar.2019.04.015 ↗
26. Anisotropy of synthetic diamond in catalytic etching using iron powder10.1016/j.apsusc.2015.04.022 ↗
27. Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite
28. Influence of length-scales on spatial distribution and interfacial characteristics of B4C in a nanostructured Al matrix10.1016/j.actamat.2015.01.062 ↗
29. Microstructure and thermal conductivity of Cu/diamond composites with Ti-coated diamond particles produced by gas pressure infiltration10.1016/j.jallcom.2015.06.062 ↗
30. High thermal conductive diamond/Cu–Ti composites fabricated by pressureless sintering technique10.1016/j.applthermaleng.2013.11.065 ↗
31. Effect of boron addition on the thermal properties of diamond-particle-dispersed Cu-matrix composites fabricated by SPS
32. Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration10.1016/j.compositesa.2016.10.005 ↗
33. Microstructure and thermal properties of diamond/copper composites with Mo2C in-situ nano-coating10.1016/j.surfcoat.2018.12.116 ↗
34. Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer10.1016/j.compositesa.2018.07.023 ↗
35. Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles10.1016/j.matchar.2014.07.025 ↗
36. Thermal expansion of a novel hybrid SiC foam–SiC particles–Al composites10.1016/j.compscitech.2007.03.020 ↗
37. Thermal-expansion stresses in reinforced plastics10.6028/jres.037.015 ↗
38. The Elastic and Thermo-elastic properties of composite media10.1088/0370-1301/69/8/305 ↗
39. Thermal expansion of some diamondlike crystals10.1063/1.321373 ↗
40. Thermal properties of diamond/copper composite material10.1016/S0026-2714(03)00215-4 ↗
41. Thermal expansion of copper from 20 to 800 K-standard reference material 73610.1063/1.1658614 ↗
42. The deformation of plastically non-homogeneous materials10.1080/14786437008238426 ↗
43. An enhanced continuum model for size-dependent strengthening and failure of particle-reinforced composites10.1016/j.actamat.2009.08.010 ↗
44. Dislocation generation due to differences between the coefficients of thermal expansion10.1016/0025-5416(86)90261-2 ↗
45. Development of a method to determine Burgers vectors from atomistic data
46. Thermal expansion behaviour of aluminium/SiC composites with bimodal particle distributions10.1016/S1359-6454(03)00126-5 ↗
47. Synergistic outstanding strengthening behavior of graphene/copper nanocomposites10.1016/j.compositesb.2019.107235 ↗
48. The mechanical and thermal expansion behavior of an Al–Si alloy composite reinforced with potassium titanate whisker10.1016/S0266-3538(00)00160-3 ↗
49. Thermal conductivity stability of interfacial in situ Al4C3 engineered diamond/Al composites subjected to thermal cycling10.3390/ma15196640 ↗
50. Elastoplastic analysis of thermal cycling: ceramic particles in a metallic matrix10.1016/0022-5096(95)00046-L ↗