Deep precision machining of SiC ceramics by picosecond laser ablation

Silicon carbide (SiC) ceramic is becoming widely used in multiple industrial applications, owing to its exceptional high-temperature properties. Yet it is still a challenge to machine SiC using traditional means without causing damage due to its high hardness and brittleness. In this study, a subtractive manufacturing technique based on the use of a fiber picosecond laser was employed to remove material from the reaction bonded SiC surface or create micro-patterns with the minimum damage to the surface, maximum surface quality and precision. Multiple laser processing parameters were investigated with the purpose of obtaining deep high-quality cuts with the minimum surface roughness and the minimum amount of the re-deposited material. The heat affected zone was analyzed by grazing angle X-ray diffractometry, cross-sectional scanning electron microscopy, energy dispersive and micro Raman spectroscopy techniques. The cut shape, depth, surface roughness as well as the kerf width and re-deposition height were assessed using a 3D laser scanning microscopy. The optimum values were established for the focal position, the laser power, linear speed, wobble frequency, wobble pattern, and number of passes. This study also identified the processing parameters for shallow and deep high-precision SiC cutting at a material removal rate of ∼2 mm³/min. The work demonstrated that the developed laser machining process is an efficient subtractive manufacturing tool that can be integrated into the automated precision cutting systems for machining hard ceramic materials such as SiC and alumina.