journal article·2022-04

High quality full ablation cutting and stealth dicing of silica glass using picosecond laser Bessel beam with burst mode

Kai Liao, Wenjun Wang, Xuesong Mei, Bin Liu

Ceramics International· Volume 48· Issue 7
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Abstract

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Research context

OpenAlex topics: Laser Material Processing Techniques · Laser-induced spectroscopy and plasma · Advanced Surface Polishing Techniques

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References (47)

Show source-provided references
1. All-organic active matrix flexible display10.1063/1.2178213 ↗
2. Biodegradable metallic glass for stretchable transient electronics10.1002/advs.202004029 ↗
3. MEMS hydrogen gas sensor with wireless quartz crystal resonator10.1016/j.snb.2021.129651 ↗
4. Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers10.1364/OE.23.032528 ↗
5. Fabrication of millimeter-scale deep microchannels in fused silica by femtosecond laser filamentation effect10.1016/j.optlastec.2021.107201 ↗
6. Perovskite photovoltaics on roll-to-roll coated ultra-thin glass as flexible high-efficiency indoor power generators10.1016/j.xcrp.2020.100045 ↗
7. Suggestion for using the thermal stable thermoelectric glasses as a strategy for improvement of photovoltaic system efficiency: seebeck coefficients of tellurite-vanadate glasses containing antimony oxide10.1016/j.solener.2016.09.035 ↗
8. An active actuator based on giant magnetostrictive composite pendulum for vibration isolation10.1088/1757-899X/629/1/012026 ↗
9. MEMS micro-glassblowing paradigm for wafer-level fabrication of fused silica wineglass gyroscopes10.1016/j.proeng.2014.11.580 ↗
10. Scratch with double-tip tool: crack behavior during simultaneous double scratch on BK7 glass10.1016/j.jeurceramsoc.2020.04.008 ↗
11. Investigation on glass/epoxy composite surfaces machined by abrasive water jet machining10.1016/j.jmatprotec.2007.07.014 ↗
12. Crack-free laser dicing of glass in the microelectronics industry10.2351/1.4821249 ↗
13. Ultrafast laser micromachining the ultra-low expansion glass-ceramic: optimization of processing parameters and physical mechanism10.1016/j.jeurceramsoc.2021.05.018 ↗
14. Laser glass cutting techniques—a review10.2351/1.4807895 ↗
15. The effect of material thickness, laser power and cutting speed on cut path deviation in high-power diode laser chip-free cutting of glass10.1016/j.optlastec.2010.01.024 ↗
16. Bottom-up cutting method to maximize edge strength in femtosecond laser ablation cutting of ultra-thin glass10.1016/j.optlastec.2021.106921 ↗
17. Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation10.1016/j.optlastec.2017.01.028 ↗
18. Ultrashort-pulsed laser separation of glass-silicone-glass substrates: influence of material properties and laser parameters on dicing process and cutting edge geometry10.1007/s00339-020-04192-z ↗
19. Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications10.1038/s41377-021-00596-5 ↗
20. Laser machining of transparent brittle materials: from machining strategies to applications10.29026/oea.2019.180017 ↗
21. In-depth comparison of conventional glass cutting technologies with laser-based methods by volumetric scribing using Bessel beam and rear-side machining10.1364/OE.402567 ↗
22. Improvement of rear damage of thin fused silica by liquid-assisted femtosecond laser cutting10.1007/s00339-019-2754-y ↗
23. Mishchik · 2016 · 97400W
24. Strength of ultra-thin glass cut by internal scribing using a femtosecond Bessel beam10.1016/j.optlastec.2020.106307 ↗
25. Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations10.1016/j.sna.2019.111723 ↗
26. Aberration-insensitive three-dimensional micromachining in glass with spatiotemporally shaped femtosecond laser pulses10.1364/OL.43.003485 ↗
27. Non-diffraction-length, tunable, Bessel-like beams generation by spatially shaping a femtosecond laser beam for high-aspect-ratio micro-hole drilling10.1364/OE.26.021960 ↗
28. High-throughput microchannel fabrication in fused silica by temporally shaped femtosecond laser Bessel-beam-assisted chemical etching10.1364/OL.43.000098 ↗
29. Improved laser glass cutting by spatio-temporal control of energy deposition using bursts of femtosecond pulses10.1364/OE.25.033271 ↗
30. CO2 laser cleavage of chemically strengthened glass10.1016/j.jmatprotec.2020.116961 ↗
31. A flexible multi-focus laser separation technology for thick glass10.1016/j.ijmachtools.2018.08.001 ↗
32. Laser multi-focus precision cutting of thick sapphire by spherical aberration rectification10.1016/j.optlaseng.2019.105876 ↗
33. An analytical model to predict the sizes of modified layer in glass with femtosecond Bessel beam10.1016/j.ijleo.2019.03.071 ↗
34. High aspect ratio nanochannel machining using single shot femtosecond Bessel beams10.1063/1.3479419 ↗
35. High quality quasi-Bessel beam generated by round-tip axicon10.1364/OE.16.012688 ↗
36. Influence of heat accumulation during laser micromachining of CoCrMo alloy with ultrashort pulses in burst mode10.1007/s00339-019-3203-7 ↗
37. Drilling, bonding, and forming conductive path in the hole by laser percussion drilling10.1016/j.precisioneng.2019.10.007 ↗
38. Two-step approach to improving the quality of laser micro-hole drilling on thermal barrier coated nickel base alloys10.1016/j.optlaseng.2019.05.002 ↗
39. CO2 laser cleavage of chemically strengthened glass10.1016/j.jmatprotec.2020.116961 ↗
40. Damage morphology and mechanism in ablation cutting of thin glass sheets with picosecond pulsed lasers10.1016/j.optlastec.2016.01.023 ↗
41. Effect of mechanical vibration on Ra, Rq, Rz, and Rt roughness parameters10.1007/s00170-017-0137-0 ↗
42. Ionization behavior and dynamics of picosecond laser filamentation in sapphire10.29026/oea.2019.190003 ↗
43. Laser-induced multiphoton and collisional ionizations in sodium-argon mixture10.1016/j.jlumin.2020.117370 ↗
44. Advanced dicing technology for semiconductor wafer—stealth dicing10.1109/TSM.2007.901849 ↗
45. Light extraction efficiency improvement by multiple laser stealth dicing in InGaN-based blue light-emitting diodes10.1364/OE.20.006808 ↗
46. Spatial zigzag evolution of cracks in moving sapphire initiated by bursts of picosecond laser pulses for ultrafast wafer dicing10.1039/D0RA06791A ↗
47. One-step femtosecond laser stealth dicing of quartz10.3390/mi11030327 ↗