Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy
Source abstract
Abstract
Abstract Wetting phenomena concerning Sn-Zn eutectic alloys with Ag addition were studied in contact with Cu substrate at 250 °C and in the presence of ALU33 flux. The chosen wetting time was 5 s. Then in situ STEM isothermal heating at 150 °C lasting for 10, 40 and 70 min was conducted to establish the sequence of phase appearance. The intermetallic phases within the Cu-Zn system were identified. The formation sequence and interface microstructure were determined. It is demonstrated that the ε-Cu(Ag)Zn4 phase appears first and it is followed by the γ-Cu(Ag)5Zn8. The resulting Cu saturated solder transforms into γ phase taking scallop-like shape.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Metallurgical and Alloy Processes
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References (18)
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