journal article·2025-05Open access

Co-creation of bioinspired capillary architectures with high thermal conductivity

Yixing Zhang, Xiupeng Chen, Yuwen Sun, Zeming Peng, Xiaolong Yang

Cell Reports Physical Science· Volume 6· Issue 5

Abstract

With increasing power density in advanced systems, efficient heat dissipation is crucial. Traditional high-thermal-conductivity materials are effective but insufficient for future cooling needs. Here, we report a bioinspired Cu-diamond composite with ultrahigh thermal conductivity and integrated hierarchical structures for sustainable boiling/evaporation cooling. A proposed diamond-seeding deposition method creates defect-free Cu-diamond composites, achieving 688.8 ± 142.1 W/(m·K) thermal conductivity at a diamond fraction of 42.1% ± 3.2%. The Sarracenia trichome-inspired graded superhydrophilic microchannels are engineered on the composite material using one-step laser ablation. The bioinspired structures reach a capillary velocity of 134.9 mm/s, surpassing the natural record by 1,052.7%, demonstrating a capability critical for sustainable boiling/evaporation. Heat management tests further confirm that the monolayer composite, coordinated with the bioinspired structures, significantly enhances both the thermal response rate and cooling performance. We envision the exquisite co-creation of thermal-functional structures as a complementary platform to cooling techniques for broad applications.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Surface Modification and Superhydrophobicity · Aerogels and thermal insulation · Heat Transfer and Optimization

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (49)

Show source-provided references
1. Nanoengineered materials for liquid-vapour phase-change heat transfer10.1038/natrevmats.2016.92 ↗
2. Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures10.1016/j.nanoen.2018.06.063 ↗
3. A novel ultra-thin flattened heat pipe with biporous spiral woven mesh wick for cooling electronic devices10.1016/j.enconman.2018.11.031 ↗
4. A review on advanced carbon-based thermal interface materials for electronic devices10.1016/j.carbon.2020.06.012 ↗
5. Heat transfer and flow analysis of Al2O3-Water nanofluids in interrupted microchannel heat sink with ellipse and diamond ribs in the transverse microchambers10.1080/01457632.2017.1379344 ↗
6. Performance analysis of double-layer microchannel heat sink with various microchannel shapes10.1615/HeatTransRes.2018018534 ↗
7. Thermal conductivity of diamond between 170 and 1200 K and the isotope effect10.1103/PhysRevB.47.14850 ↗
8. Ultrahigh thermal conductivity in isotope-enriched cubic boron nitride10.1126/science.aaz6149 ↗
9. Experimental observation of high thermal conductivity in boron arsenide10.1126/science.aat5522 ↗
10. High thermal conductivity in cubic boron arsenide crystals10.1126/science.aat8982 ↗
11. Unusual high thermal conductivity in boron arsenide bulk crystals10.1126/science.aat7932 ↗
12. High thermal conductivity composite of diamond particles with tungsten coating in a copper matrix for heat sink application10.1016/j.applthermaleng.2012.04.063 ↗
13. Regulating interface adhesion and enhancing thermal conductivity of diamond/copper composites by ion beam bombardment and following surface metallization pretreatment10.1016/j.jallcom.2018.01.078 ↗
14. Enhanced thermal conductivity of diamond/copper composite fabricated through doping with rare-earth oxide ScO2310.1016/j.diamond.2020.107755 ↗
15. Effective thermal conductivity of Cu/diamond composites containing connected particles10.1179/026708309X12567268926722 ↗
16. Lightweight diamond/Cu interface tuning for outstanding heat conduction10.1002/cey2.379 ↗
17. Design, manufacturing, and testing of a laser textured piston ring surface reinforced with a CuCoBe-diamond composite by hot-pressing10.1007/s00170-023-10871-x ↗
18. Research on Multiple Arc Erosion Properties of Cu-Diamond Composites
19. Microstructure evolution of diamond with molybdenum coating and thermal conductivity of diamond/copper composites fabricated by spark plasma sintering10.1007/s10854-022-08441-0 ↗
20. Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering10.3390/ma12030475 ↗
21. Thermal conductivity of Cu-Ti/diamond composites via spark plasma sintering10.1016/j.diamond.2019.02.014 ↗
22. High-Temperature Thermal Conductivity and Thermal Cycling Behavior of Cu-B/Diamond Composites10.1109/TCPMT.2019.2958056 ↗
23. Thermal conductivity of bulk nanocrystalline nickel-diamond composites produced by electrodeposition10.1016/j.jallcom.2016.06.152 ↗
24. Schanz · 2008 · 395
25. Enhanced interface structure of electroformed copper/diamond composites for thermal management applications10.1515/mt-2023-0236 ↗
26. High thermal conductive Cu-diamond composites synthesized by electrodeposition and the critical effects of additives on void-free composites10.1016/j.ceramint.2019.06.215 ↗
27. Fundamental issues, mechanisms and models of flow boiling heat transfer in microscale channels10.1016/j.ijheatmasstransfer.2016.12.003 ↗
28. Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays10.1016/j.nanoen.2017.05.028 ↗
29. Matrix microstructure deteriorations resulting from diamond incorporation in electroplated metal–diamond composites10.1016/j.surfcoat.2007.06.029 ↗
30. Ultrahydrophobicity of ZnO modified CVD diamond films10.1016/j.apsusc.2012.12.172 ↗
31. Fabrication of high thermal conductivity Cu/diamond composites at ambient temperature and pressure10.1063/1.5111416 ↗
32. Thermal conductivity of copper-diamond composite materials produced by electrodeposition and the effect of TiC coatings on diamond particles10.1016/j.compositesb.2018.08.014 ↗
33. Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating10.1016/j.ceramint.2019.04.008 ↗
34. Fabrication of High Thermal Conductivity Cu/Diamond Composites By Electrodeposition10.1149/MA2014-02/49/2220 ↗
35. Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions10.1007/s10800-020-01414-3 ↗
36. Sedra · 1987
37. Creation of Topological Ultraslippery Surfaces for Droplet Motion Control10.1021/acsnano.0c07417 ↗
38. Directional water collection on wetted spider silk10.1038/nature08729 ↗
39. Enhanced Fog Harvesting through Capillary-Assisted Rapid Transport of Droplet Confined in the Given Microchannel10.1021/acsami.1c14696 ↗
40. A multi-structural and multi-functional integrated fog collection system in cactus10.1038/ncomms2253 ↗
41. Three-dimensional capillary ratchet-induced liquid directional steering10.1126/science.abg7552 ↗
42. Wettability patterning for high-rate, pumpless fluid transport on open, non-planar microfluidic platforms10.1039/C3LC51406D ↗
43. Ultrafast water harvesting and transport in hierarchical microchannels10.1038/s41563-018-0171-9 ↗
44. Laser turns silicon superwicking10.1364/OE.18.006455 ↗
45. A generalization of the Lucas–Washburn–Rideal law to composite microchannels of arbitrary cross section10.1007/s10404-014-1519-3 ↗
46. Optimization for ultrafast capillary-driven flow in open rectangular microchannels10.1016/j.ijheatmasstransfer.2022.123629 ↗
47. Analysis of Capillary Flow in a Parallel Microchannel-Based Wick Structure with Circular and Noncircular Geometries10.1021/acs.langmuir.0c02226 ↗
48. Experimental investigation of capillary force in a novel sintered copper mesh wick for ultra-thin heat pipes10.1016/j.applthermaleng.2016.12.056 ↗
49. Boiling nucleation10.1016/S0065-2717(08)70110-2 ↗