journal article·2026-05-04Open access

Dual‐Field Synergistic Orientation of Carbon Fibers for High‐Efficiency Thermal Management

Zujian Zhao, Kang Xu, Yue Qin, Boren Yang, Kaiyuan Li, Linhong Li, Rongjie Yang, Yandong Wang, Hanxi Chen, Yiwei Zhou, Tao Cai, Cheng‐Te Lin, Kazuhito Nishimura, Maohua Li, Nan Jiang, Jinhong Yu

Abstract

ABSTRACT Modern electronic components are trending toward miniaturization and high‐power‐density, which leads to the accumulation of heat and causes thermal‐induced functional failure. To address this challenge, the development of efficient thermal interface materials (TIMs) as the thermal bridge between the heat source and heat sink has become essential. However, fabricating high‐performance TIMs by achieving precise alignment of mesophase pitch‐based carbon fibers (MPCF) with exceptionally high axial thermal conductivity remains a significant technical challenge. In this study, we develop a dual‐field strategy that synergistically combines reversing electric and low magnetic fields (0.2 T) to fabricate highly aligned carbon fiber (CF)‐based TIMs. A photocurable gel was employed as the polymer matrix to improve the efficiency of composite fabrication. The resulting composite exhibits an excellent through‐plane thermal conductivity as high as 84.88 W m −1 K −1 at 35 wt% CF loading. By addressing the limited alignment precision of the conventional electrostatic flocking techniques, this work provides a novel insight into designing high‐performance TIMs with vertically aligned CF, demonstrating great potential for advanced thermal management applications.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Thermal properties of materials · Aerogels and thermal insulation · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials Science and Chemical Engineering Ningbo University Ningbo Zhejiang China

Zhejiang Key Laboratory of Extreme‐environmental Material Surfaces and Interfaces, State Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering Chinese Academy of Sciences Ningbo Zhejiang China

Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing China

Funding

National Natural Science Foundation of China · Natural Science Foundation of Ningbo Municipality

References (59)

Show source-provided references
1. Liquid‐Infused Nanostructured Composite as a High‐Performance Thermal Interface Material for Effective Cooling10.1038/s41467-025-56163-8 ↗
2. Comprehensive Review and Future Prospects on Chip‐Scale Thermal Management: Core of Data Center's Thermal Management10.1016/j.applthermaleng.2024.123612 ↗
3. Mechanochemistry‐Mediated Colloidal Liquid Metals for Electronic Device Cooling at Kilowatt Levels10.1038/s41565-024-01793-0 ↗
4. Research Progress of Filled‐Type High‐Thermal‐Conductivity Flexible Polyimide Composites: A Review10.1007/s10853-023-09040-y ↗
5. Thermal Conductive Radiative Cooler Enabled by Janus Structure for Above‐Ambient Daytime Cooling10.1016/j.nanoen.2025.111124 ↗
6. Dual‐Functional Carbon Material Possessing Light Absorption and Heat Conduction & Energy Storage10.1007/s42114-025-01371-5 ↗
7. Morphology‐Controllable Liquid Metal/Diamond Sandwich‐Structured Thermal Interface Material Toward High‐Efficiency Thermal Management10.1021/acsnano.5c03918 ↗
8. Polymer Composites With High Thermal Conductivity: Theory, Simulation, Structure and Interfacial Regulation10.1016/j.pmatsci.2024.101362 ↗
9. Emerging Trends and Challenges in Thermal Interface Materials: A Comprehensive Perspective From Fundamentals to Applications10.1016/j.mser.2025.100968 ↗
10. Performance of Thermal Interface Materials10.1002/smll.202200693 ↗
11. Phonon‐Engineered Extreme Thermal Conductivity Materials10.1038/s41563-021-00918-3 ↗
12. Performance Analysis of Gallium‐Based Liquid Metal as Thermal Interface Material for Chip Heat Dissipation10.1016/j.ijthermalsci.2025.110121 ↗
13. Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials With High Solid Filling yet Excellent Thixotropy10.1002/adfm.202214071 ↗
14. Stress Induced Carbon Fiber Orientation for Enhanced Thermal Conductivity of Epoxy Composites10.1016/j.compositesb.2020.108599 ↗
15. Thermal Conductivity of Polymers and Polymer Nanocomposites10.1016/j.mser.2018.06.002 ↗
16. Materials for Thermal Conduction10.1016/S1359-4311(01)00042-4 ↗
17. Soft Alumina‐Based Thermal Interface Materials With Enhanced Thermal Properties Enabled by the Synergistic Effect With Hexagonal Boron Nitride and Liquid Metal10.1016/j.jmst.2025.05.019 ↗
18. Thermal Conductivity of Polymer‐Based Composites: Fundamentals and Applications10.1016/j.progpolymsci.2016.03.001 ↗
19. A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects10.1002/adfm.202301549 ↗
20. A Mini Review on Factors Affecting Network in Thermally Enhanced Polymer Composites: Filler Content, Shape, Size, and Tailoring Methods10.1007/s42114-021-00321-1 ↗
21. Thermally Conductive and Electrically Insulative Alumina/Epoxy Composites for Advanced Electronic Packaging Applications: A Comprehensive Review of Filler Morphologies and Surface Modifications10.1016/j.mattod.2025.03.011 ↗
22. Functionalized Aluminum Nitride for Improving Hydrolysis Resistances of Highly Thermally Conductive Polysiloxane Composites10.1007/s40820-025-01669-5 ↗
23. Highly Thermal Conductive and Flexible Silicone Paste Filled With Alumina and Aluminum Nitride Hybrid Fillers10.1016/j.surfin.2025.107291 ↗
24. Thermal Conductivity of Polymers and Their Nanocomposites10.1002/adma.201705544 ↗
25. Factors Affecting Thermal Conductivities of the Polymers and Polymer Composites: A Review10.1016/j.compscitech.2020.108134 ↗
26. Tetris‐Style Stacking Process to Tailor the Orientation of Carbon Fiber Scaffolds for Efficient Heat Dissipation10.1007/s40820-023-01119-0 ↗
27. A Novel CFRP Composite With Bi‐Directional High Thermal Conductivity via Quantum Dots Modified Filler and Electrodeposited Cu Modified Carbon Fiber10.1016/j.carbon.2025.120522 ↗
28. Densifying Conduction Networks of Vertically Aligned Carbon Fiber Arrays With Secondary Graphene Networks for Highly Thermally Conductive Polymer Composites
29. Extraordinary Thermal Conductivity of Polyvinyl Alcohol Composite by Aligning Densified Carbon Fiber via Magnetic Field10.1007/s12274-022-5023-x ↗
30. Preparation Processes and Thermal Conductivities of Magnetic Field‐ and Torsional Vibration‐Induced Superoriented Carbon Fiber Composites10.1016/j.compscitech.2024.110617 ↗
31. A Biomimetic Thermal Conduction Network Enables Metal‐Level Thermal Conductivity in Polymer Nanocomposites10.1021/acsnano.5c12250 ↗
32. Highly Thermally Conductive and Mechanically Strong Graphene Fibers10.1126/science.aaa6502 ↗
33. Large‐Scale Preparation of Thermally Conductive Graphene Fiber Filaments10.1016/j.carbon.2024.118947 ↗
34. Highly Thermally Conductive and High Shear Strength Graphene Fiber Composites via Molecular Conjugation Interface Engineering for Extreme Thermal Management10.1002/adfm.202522804 ↗
35. Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi‐Directional Thermal Conduction10.1007/s40820-024-01426-0 ↗
36. Multifunctional Performance of Carbon Nanotubes in Thermal Energy Storage Materials10.1016/j.mattod.2024.04.005 ↗
37. Electrically Insulating PBO/MXene Film With Superior Thermal Conductivity, Mechanical Properties, Thermal Stability, and Flame Retardancy10.1038/s41467-023-40707-x ↗
38. Hexagonal Boron Nitride Nanosheets: Preparation, Heat Transport Property and Application as Thermally Conductive Fillers10.1016/j.pmatsci.2023.101154 ↗
39. Large‐Scale Production of Boron Nitride Nanosheets for Flexible Thermal Interface Materials With Highly Thermally Conductive and Low Dielectric Constant10.1016/j.compositesb.2023.111164 ↗
40. Ultra‐High Thermal Conductivity Multifunctional Composites With Uniaxially Oriented Boron Nitride Sheets for Future Wireless Charging Technology10.1007/s42114-025-01308-y ↗
41. Highly Oriented BN‐Based TIMs With High Through‐Plane Thermal Conductivity and Low Compression Modulus10.1039/D4MH00626G ↗
42. Ultrahigh Thermal Conductive yet Superflexible Graphene Films10.1002/adma.201700589 ↗
43. Synergistic Effect of Aligned Graphene Nanosheets in Graphene Foam for High‐Performance Thermally Conductive Composites10.1002/adma.201900199 ↗
44. Plants‐Inspired Cellulose Nanocomposites‐Based Soft Intelligent Actuators With Exceptional Thermal Conductivity and Electromagnetic Interference Shielding10.1002/adma.202513893 ↗
45. Stiff Yet Tough, Moisture‐Tolerant, Room Temperature Self‐Healing and Thermoconductive Biomimetic Nanocomposites10.1002/adma.202507548 ↗
46. An Efficient Thermal Interface Material With Anisotropy Orientation and High Through‐Plane Thermal Conductivity10.1016/j.compscitech.2022.109784 ↗
47. Ultrahigh Thermal Conductive Polymer Composites by the 3D Printing Induced Vertical Alignment of Carbon Fiber10.1039/D3TA01676E ↗
48. Elastomeric Thermal Interface Materials With High Through‐Plane Thermal Conductivity From Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking10.1002/adma.201401736 ↗
49. Vertically Aligned Carbon Fiber/Polydimethylsiloxane Composites Prepared by Lyophilization With Exceptional Thermal Conductivity and Electromagnetic Interference Shielding Performance10.1016/j.cej.2024.151620 ↗
50. Magnetic Field‐Oriented One‐Step Fabrication of Metal‐Grade Thermally Conductive Carbon Fiber Flexible Thermal Pad10.1002/adfm.202505225 ↗
51. Scalable Compliant Graphene Fiber‐Based Thermal Interface Material With Metal‐Level Thermal Conductivity via Dual‐Field Synergistic Alignment Engineering10.1021/acsnano.4c04349 ↗
52. Magnetic Orientation of Polymer Fibers in Suspension10.1021/la990761j ↗
53. Multi‐Interfacial Heterostructure Design of Carbon Fiber/Silicone Rubber‐Oriented Composites for Microwave Absorption and Thermal Management10.1002/adfm.202411573 ↗
54. Self‐Adaptive Thermal Interface Materials Featuring Low Thermal Resistance by Combining Phase Change Materials With Magnetic Field‐Induced Filler Alignment10.1016/j.compositesb.2025.112687 ↗
55. Elastomeric Thermal Interface Materials With High Through‐Plane Thermal Conductivity by 3D Printing10.1002/app.55500 ↗
56. Enhanced Thermal Conductivity and Reduced Thermal Resistance in Carbon Fiber‐Based Thermal Interface Materials With Vertically Aligned Structure10.1039/D4TA03924F ↗
57. Fabrication of Aligned Carbon‐Fiber/Polymer TIMs Using Electrostatic Flocking Method
58. Tough PEGgels by In Situ Phase Separation for 4D Printing10.1002/adfm.202300947 ↗
59. Tough, Transparent, 3D‐Printable, and Self‐Healing Poly(Ethylene Glycol)‐Gel (PEGgel)10.1002/adma.202107791 ↗