Back Cover Image, Volume 7, Number 2, February 2025
Source abstract
Abstract
Back cover image: The cover image visualizes a passive thermal management strategy designed to take away heat from electronics using water evaporation. The strategy utilizes moisture desorption from a low-cost hygroscopic salt solution to extract heat and prevent electronics from overheating, importantly, it can spontaneously recover cooling capacity during off hours. Compared with traditional PCM of the same bulk volume, the temperature reduction could reach 16.3°C while extending the effective cooling time by ∼343%. Cover art by Zengguang Sui and Wei Wu.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Earthquake and Disaster Impact Studies · Diverse Scientific and Economic Studies · Educational Reforms and Innovations
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Energy and Environment City University of Hong Kong Hong Kong China
City University of Hong Kong Shenzhen Research Institute Shenzhen China
References
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