journal article·2024-08Open access

Ultrahigh thermoelectric properties of p‐type BixSb2−xTe3 thin films with exceptional flexibility for wearable energy harvesting

Zhuang‐Hao Zheng, Yi‐Ming Zhong, Yi‐Liu Li, Mohammad Nisar, Adil Mansoor, Fu Li, Shuo Chen, Guang‐Xing Liang, Ping Fan, Dongyan Xu, Meng Wei, Yue‐Xing Chen

Carbon Energy· Volume 6· Issue 8

Abstract

Abstract Use of a flexible thermoelectric source is a feasible approach to realizing self‐powered wearable electronics and the Internet of Things. Inorganic thin films are promising candidates for fabricating flexible power supply, but obtaining high‐thermoelectric‐performance thin films remains a big challenge. In the present work, a p‐type BixSb2−xTe3 thin film is designed with a high figure of merit of 1.11 at 393 K and exceptional flexibility (less than 5% increase in resistance after 1000 cycles of bending at a radius of ∼5 mm). The favorable comprehensive performance of the BixSb2−xTe3 flexible thin film is due to its excellent crystallinity, optimized carrier concentration, and low elastic modulus, which have been verified by experiments and theoretical calculations. Further, a flexible device is fabricated using the prepared p‐type BixSb2−xTe3 and n‐type Ag2Se thin films. Consequently, an outstanding power density of ∼1028 μW cm−2 is achieved at a temperature difference of 25 K. This work extends a novel concept to the fabrication of high‐performance flexible thin films and devices for wearable energy harvesting.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced Thermoelectric Materials and Devices · Thermal properties of materials · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Shenzhen Key Laboratory of Advanced Thin Films and Applications, Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Physics and Optoelectronic Engineering Shenzhen University Shenzhen China

Department of Mechanical and Automation Engineering The Chinese University of Hong Kong Sha Tin China

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