High-throughput fabrication and screening of interface-engineered diamond/Cu composites: Effects of coating chemistry, thickness, and heat treatment on thermal transport and stability
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Aluminum Alloys Composites Properties · 3D IC and TSV technologies · Diamond and Carbon-based Materials Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (65)
Show source-provided references
1. Using life cycle assessment to drive innovation for sustainable cool clouds10.1038/s41586-025-08832-3 ↗
2. Moore's law: the journey ahead10.1126/science.ade2191 ↗
3. A critical review on the thermal management of data center for local hotspot elimination10.1016/j.enbuild.2023.113486 ↗
4. Cooling of high heat flux miniaturized electronic devices using thermal ground plane: an overview10.1016/j.rser.2022.112956 ↗
5. Phase-change materials for thermal management of electronic devices10.1016/j.applthermaleng.2022.118839 ↗
6. Emerging advanced electronic packaging materials for thermal management in power electronics10.1002/advs.202524348 ↗
7. Advances on thermally conductive epoxy‐based composites as electronic packaging underfill Materials—A review
8. Diamond/Cu composites microchannel heat sink for effective thermal management of SiC power devices10.1016/j.applthermaleng.2025.129116 ↗
9. Shah · 2024
10. Chang · 2025
11. Dai · 2020
12. A review of diamond interfacial modification and its effect on the properties of diamond/Cu matrix composites
13. Orientation independent heat transport characteristics of diamond/copper interface with ion beam bombardment10.1016/j.actamat.2021.117283 ↗
14. Evaluation on the interface characteristics, thermal conductivity, and annealing effect of a hot-forged Cu-Ti/diamond composite10.1016/j.jmst.2020.02.023 ↗
15. Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration10.1016/j.compositesa.2016.10.005 ↗
16. Thermal conductivity of Cu-Ti/diamond composites via spark plasma sintering10.1016/j.diamond.2019.02.014 ↗
17. Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites10.1016/j.jallcom.2018.03.241 ↗
18. Fabrication and use of cu-cr-diamond composites for the application in deep feed grinding of tungsten carbide10.1016/j.diamond.2021.108668 ↗
19. Tailoring the thermal and mechanical properties of diamond/Cu composites by interface regulation of Cr alloying10.1016/j.diamond.2021.108309 ↗
20. Reinforcement size effect on thermal conductivity in Cu-B/diamond composite10.1016/j.jmst.2021.03.018 ↗
21. High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration10.1016/j.jallcom.2017.11.273 ↗
22. Microstructure and tensile properties of Cu-B/diamond composites with various diamond particle sizes10.1016/j.jallcom.2025.182208 ↗
23. Interfacial structure evolution and thermal conductivity of Cu-Zr/diamond composites prepared by gas pressure infiltration10.1016/j.jallcom.2018.12.053 ↗
24. On the thermal conductivity of Cu–Zr/diamond composites10.1016/j.matdes.2012.09.006 ↗
25. Thermal conductivity of Cu–Zr/diamond composites produced by high temperature–high pressure method10.1016/j.compositesb.2014.08.023 ↗
26. Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond10.1016/j.actamat.2018.09.004 ↗
27. Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles10.1016/j.scriptamat.2011.09.028 ↗
28. High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite10.1016/j.carbon.2020.07.001 ↗
29. Enhanced mechanical properties in diamond/Cu composites with chromium carbide coating for structural applications10.1016/j.msea.2013.09.034 ↗
30. Double layer interfacial structure of Cr3C2–Cr7C3 in copper/diamond composites for thermal management applications10.1016/j.applthermaleng.2024.123958 ↗
31. Preparation of copper–diamond composites with chromium carbide coatings on diamond particles for heat sink applications10.1016/j.applthermaleng.2013.05.038 ↗
32. Thermal properties of tungsten/tungsten carbide-coated double-size diamond/copper composite10.1016/j.diamond.2023.109818 ↗
33. Diamond–tungsten based coating–copper composites with high thermal conductivity produced by Pulse Plasma Sintering10.1016/j.matdes.2015.03.056 ↗
34. Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder10.1016/j.compositesb.2013.04.017 ↗
35. Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites10.1016/j.jallcom.2012.03.045 ↗
36. Surface modification of hard diamond particles with Cu-Mo2C double layer coating and its application in thermal conductive composites10.1016/j.diamond.2025.112950 ↗
37. Effect of diamond particle size on thermal conductivity and thermal stability of Zr-diamond/Cu composite10.1016/j.diamond.2024.111257 ↗
38. Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles10.1016/j.vacuum.2022.111133 ↗
39. Microstructure and thermal behavior of diamond/Cu composites: effects of surface modification10.1016/j.diamond.2018.04.020 ↗
40. Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles10.1016/j.matchar.2014.07.025 ↗
41. A comprehensive exploration of thermal transport at Cu/diamond interfaces via machine learning potentials10.1038/s41524-025-01843-8 ↗
42. Effect of interface structure on thermal conductivity and stability of diamond/aluminum composites10.1016/j.compositesa.2022.107161 ↗
43. High thermal conductive copper/diamond composites: state of the art10.1007/s10853-020-05443-3 ↗
44. Study on the interfacial structure and thermal conduction of spark plasma sintering diffusion‐bonded Diamond/Cu composites with Ni interlayer
45. Study of the hot-pressing sintering process of diamond/copper composites and their thermal conductivity10.1016/j.jallcom.2023.170608 ↗
46. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications10.1016/j.scriptamat.2007.10.011 ↗
47. Shape, microstructure and properties of diamond/copper composites prepared by binder jet additive manufacturing10.1016/j.ijrmhm.2025.107148 ↗
48. Combined LPBF and Post-HIP approach for fabricating diamond/Cu composites with improved thermal, mechanical and tribological performance10.1016/j.msea.2026.149953 ↗
49. Manufacturing of complex diamond-based composite structures via laser powder-bed fusion
50. Microstructure and thermal conductivity of Cu/diamond composites with Ti-coated diamond particles produced by gas pressure infiltration10.1016/j.jallcom.2015.06.062 ↗
51. Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration10.1016/j.jallcom.2019.04.252 ↗
52. Pressure infiltration of packed ceramic particulates by liquid metals10.1016/S1359-6454(99)00318-3 ↗
53. Surface energy contributions to the work of infiltration in metal matrix composite processing10.1016/j.scriptamat.2021.114223 ↗
54. Atomic-scale diffusion rates during growth of thin metal films on weakly-interacting substrates10.1038/s41598-019-43107-8 ↗
55. Roughness and correlations in the transition from island to film growth: simulations and application to CdTe deposition10.1016/j.apsusc.2021.149946 ↗
56. Infrared thermography for temperature measurement and non-destructive testing10.3390/s140712305 ↗
57. Development and application of Infrared Thermography non-destructive testing techniques10.3390/s20143851 ↗
58. Thermal transport and thermal diffusivity by laser flash technique: a review10.1007/s10765-024-03479-0 ↗
59. Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix10.1016/j.matchar.2019.04.015 ↗
60. Interfacial thermal conductance between Cu and diamond with interconnected W−W2 C interlayer10.1021/acsami.2c07190 ↗
61. High thermal conductivity diamond–copper composites prepared via hot pressing with tungsten–coated interfacial layer optimization10.3390/ma18163882 ↗
62. Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element10.1016/j.jmrt.2024.10.250 ↗
63. Thermal conducting mechanisms in tungsten-coated diamond/copper composites10.1016/j.diamond.2025.113287 ↗
64. Quantifying the influence of porosity on the thermophysical properties of diamond/Al-alloy matrix composite utilizing Micro-CT and finite element modeling10.1016/j.diamond.2024.111896 ↗
65. Effect of heat-treatment on stress relief and dimensional stability behavior of SiCp/Al composite with high SiC content10.1016/j.matdes.2015.07.044 ↗