Stepwise via formation on multilayered metal/polymer structures by CO2 laser percussion drilling and its application to multilayered micro and nanoelectronic devices

A novel method to drill stepwise vias on a multilayered metal/polymer structure by using a CO2 laser percussion drilling process is developed, in which the Gaussian intensity distribution of the CO2 laser and the differences in CO2 laser absorption and melting characteristics between the metal and polymer layers are understood to be the key factors. As a model device, gold and poly(vinylidene fluoride-trifluoroethylene-clorotrifluoroethylene) [P(VDF-TrFE-CTFE)] films were alternatively stacked to form a multilayer structure, and the CO2 laser percussion drilling process was optimized to produce stepwise vias on the gold/P(VDF-TrFE-CTFE) multilayer structure. After the deposition of an interconnection metal on the stepwise vias, the electrical resistance of the stepwise vias was measured and confirmed that the stepwise vias produced by the present method could provide a good electrical interconnection for multilayered metal/polymer electronic devices.