Crack-free laser dicing of glass in the microelectronics industry
Source abstract
Abstract
This paper investigates laser dicing of glass (commercial Borofloat®33) for backend packaging in the microelectronics industry. An ultraviolet (355 nm) diode-pumped solid-state nanosecond laser was used in this investigation. Laser processing of glass is challenging as glass is transparent for most available wavelengths. Nonlinear absorption can be obtained but produces undesirable effects (chipping, cracks) in the nanosecond regime. In the present study, an absorptive polymer layer was spin coated on top of the substrate and acts as a heat incubator during laser irradiation. This paper shows that preheating the substrate produces clean scribe. Laser dicing is qualitatively and quantitatively more efficient than blade sawing. 1 × 1 mm2 dice have been separated by laser scribe/break method that allows a throughput increase of 18%versus blade sawing.
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Research context
OpenAlex topics: Laser Material Processing Techniques · Advanced Surface Polishing Techniques · Ocular and Laser Science Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
GREMI-UMR 7344, CNRS/Université d'Orléans , 14 rue d'Issoudun, BP 6744, F-45067 Orléans cedex 2, France and , France
STMicroelectronics, 10 rue de Thalès de Milet, CS 97155, 37071 Tours Cedex 2 , 14 rue d'Issoudun, BP 6744, F-45067 Orléans cedex 2, France and , France
STMicroelectronics , 16 rue Pierre et Marie Curie, BP 7155, F-37071 Tours Cedex2, France
GREMI-UMR 7344, CNRS/Université d'Orléans , 14 rue d'Issoudun, BP 6744, F-45067 Orléans cedex 2, France
References (17)
Show source-provided references
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